A kind of manufacturing method of led light bar and led light bar
A technology of LED light bar and manufacturing method, which is applied to lighting devices, lighting and heating equipment, electrical components, etc., can solve the problems of increasing costs and affecting the light output effect of LED light bars, achieve uniform light emission, solve the problem of side light leakage, reduce cost effect
Active Publication Date: 2016-08-17
YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD
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Problems solved by technology
This not only increases the cost, but also affects the normal light emitting effect of the front and back of the LED light bar
Method used
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[0030] As mentioned in the background art, the traditional LED light emitting device only emits light from one side, so the light utilization rate is not high. In the prior art, in order to improve the above problems, a double-sided LED light-emitting light bar is proposed. Through the cooperation of the transparent substrate and the transparent substrate LED chip, the upper and lower surfaces of the transparent substrate are covered with a package mixed with phosphor powder. Glue to realize the LED light strip with two sides emitting light. However, in this prior art, since the encapsulation glue on the upper and lower surfaces is in the form of front covering during the process of making LED light strips, after cutting, the cut surface of each LED light strip, that is, the side is not covered. Encapsulation glue. In this way, it will inevitably cause light leakage from the side of the LED, which will not only destroy the uniformity of the LED’s light emission, but also in o...
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An LED light bar manufacturing method and an LED light bar (26) manufactured using the LED light bar manufacturing method. The method comprises: providing a transparent substrate (20), wherein at least one framework region (21) for fixing LED chips (23) is provided on the transparent substrate (20), both sides of each framework region (21) are respectively provided with at least one milling groove (22) parallel with the frame work region (21), and the milling groove (22) is a groove body penetrating through an upper surface and a lower surface of the transparent substrate (20); arranging several LED chips (23) in the frame work region (21) through a die bond process, the LED chips (23) in the same framework region (21) forming an LED chip column; connecting positive and negative electrodes of adjacent LED chips (23) in the same LED chip column through a wire-bond process; coating with, packaging adhesive (25) mixed with fluorescent powder, an upper surface and a lower surface of the region of the transparent substrate (20) in which the LED chips (23) are arranged through a moulding process, and fully filling the milling groove (22) with the packaging adhesive (25) under the action of pressure; and after the packaging adhesive (25) is solidified, cutting along the milling groove (22) to obtain an LED light bar (26) with adhesive around same, thereby enabling all the four sides of the LED light bar (26) finally obtained by cutting to be coated with the packaging adhesive (25), and overcoming the problem of original side-surface light leakage. The LED light bar (26) manufactured using the method not only emits uniform light, but also has no need to increase the use of fluorescent powder because of high colour temperature consistency, thereby reducing costs.
Description
technical field [0001] The invention belongs to the technical field of LED encapsulation, and in particular relates to a method for manufacturing an LED light bar with four sides of adhesive. Background technique [0002] Light Emitting Diode (LED) can directly convert electrical energy into light energy. LED chip is made up of two parts, and a part is P-type semiconductor, and inside it occupies an leading position in hole, and the other end is N-type semiconductor, mainly electron. When these two kinds of semiconductors couple together, between them, just form a "P-N junction". When electric current acts on this chip by wire time, electron will be pushed to P district, and in P district, electron is with hole recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is. [0003] As a new type of light source, LED has been increasingly widely used in the field of lighting due to its characteristics of energy saving, envir...
Claims
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IPC IPC(8): H01L33/54F21S4/24
CPCH01L25/0753H01L24/97H01L25/50H01L33/501H01L33/505H01L33/507H01L33/54H01L2933/0033H01L2933/0041H01L2933/005
Inventor 黄勇鑫羊鹏充国林袁永刚
Owner YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD