A board temperature monitoring method, device, equipment and readable storage medium
A board card and temperature data technology, applied in the computer field, can solve problems such as board card failure to start, board card aging, etc.
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Embodiment 1
[0026] This embodiment provides a method for monitoring the temperature of a board.
[0027] see figure 1 , the figure shows that the method includes step S100, step S200, step S300 and step S700.
[0028] S100. Acquire first information in real time. The first information includes temperature data collected by at least three temperature detectors within a first time period. The first time period is a time period with the current time as the end point and a preset time length. Each temperature The detectors monitor the temperature on one board individually.
[0029] It should be noted that, in the present application, the preset time length in the first time period is preferably 1 h, and those skilled in the art may also select other times. However, it should be noted that at the beginning of the first time period in this application, it must be the monitored device and the device that starts to run stably. It should also be noted that in practice, the number of temperature...
Embodiment 2
[0079] like figure 2 As shown, this embodiment provides a board temperature monitoring method device, the device includes:
[0080] The first acquisition unit 1 is used to acquire the first information in real time, the first information includes temperature data collected by at least three temperature detectors within the first time period, the first time period is the preset time length with the current moment as the end point During the time period, each temperature detector monitors the temperature on a board respectively.
[0081] The conversion unit 2 is configured to convert the first information into a temperature-time curve corresponding to each temperature detector.
[0082] Decomposition unit 3, configured to decompose each temperature-time curve into at least two order components.
[0083] The first logic unit 7 is used to determine the energy change corresponding to each component in the same-order component set. The same-order component set is a set of compone...
Embodiment 3
[0112] Corresponding to the above method embodiment, this embodiment also provides a board temperature monitoring method device, a board temperature monitoring method device described below and a board temperature monitoring method described above can correspond to each other refer to.
[0113] image 3 It is a block diagram of a board temperature monitoring device 800 shown according to an exemplary embodiment. like image 3 As shown, the board temperature monitoring device 800 may include: a processor 801 and a memory 802 . The board temperature monitoring device 800 may also include one or more of a multimedia component 803 , an I / O interface 804 , and a communication component 805 .
[0114] Wherein, the processor 801 is used to control the overall operation of the board temperature monitoring method device 800, so as to complete all or part of the steps in the above board temperature monitoring method. The memory 802 is used to store various types of data to support t...
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