Light-emitting device and manufacturing method thereof, lighting device and display device

Abstract

The invention provides a light-emitting device and a manufacturing method thereof, a lighting device and a display device.The light-emitting device is provided with an expansion component used for increasing the area of electric connection structures of a light-emitting component, and the expansion component comprises two expansion base materials correspondingly connected with the two electric connection structures and an insulation reflection coating coated on the expansion base materials; the insulation reflection coating covers the extension base materials in the mode that the back faces of the extension base materials are exposed out and the front faces of the extension base materials are partially exposed out, the insulation reflection coating further fills the gap between the two extension base materials, and connection between the two extension base materials is enhanced through the arrangement of the insulation reflection coating. And the connection between the extension base material and the light-emitting component in the preparation process is firm, the function of reflecting light can be achieved, the extension component structure can be made to be very thin, the thickness can be smaller than 50 microns, and the high reliability and the high light emitting intensity are guaranteed through the insulating reflection coating.

Description

technical field [0001] The invention relates to the technical field of light-emitting semiconductors, in particular to a light-emitting device and a manufacturing method thereof, an illuminating device and a display device. Background technique [0002] In practical applications of existing light-emitting devices, it is necessary to fix their electrical connection structures (electrodes) to corresponding connection parts (such as pads on the carrier board). Since the size of the light-emitting device itself is small, its corresponding electrical connection structure is even smaller. , it will be more difficult to fix. Therefore, expansion pads are often prepared on the electrical connection structure of the light-emitting device to expand the welding area of ​​the electrical connection structure. However, the current expansion pads are all on an insulating substrate. Conductive expansion pads are provided on both the front and back sides, and a through hole is opened in the ...

AI Technical Summary

Problems solved by technology

If the overall thickness of this extended pad is made too thin, the metal filled in the through hole is likely to break. Usually the overall thickness is greater than 100 μm, and if the thickness is large, it will increase the overall thickness of the light emitting device.

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