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Cooling fin, cooling structure and processing method

A technology of heat dissipation structure and heat sink, applied in the direction of cooling/ventilation/heating transformation, can solve the problem of large thickness of the radiator, and achieve the effect of good heat dissipation performance and thin overall thickness

Pending Publication Date: 2022-04-08
LIANDE ELECTRONIC TECH (CHANGSHU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thickness of this radiator is relatively large, and it is difficult for the existing heat dissipation sheet to adopt this structure to fix the heat pipe

Method used

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  • Cooling fin, cooling structure and processing method
  • Cooling fin, cooling structure and processing method
  • Cooling fin, cooling structure and processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as Figure 1 to Figure 6 As shown, the embodiment of the present application provides a heat sink 11 on which a heat pipe groove 12 for accommodating a heat pipe is opened, and several bosses for riveting the heat pipe are provided on both sides of the heat pipe groove 12 . In this application, "riveting" refers to a fixing method in which the boss covers part of the area of ​​the heat pipe and fixes the heat pipe in the heat pipe groove 12 . In this embodiment, the bosses are divided into first-type bosses 13 higher than the upper surface of the heat sink 11 and second-type bosses 14 higher than the lower surface of the heat sink 11 . With such a structure, the heat transfer tube can be respectively covered from the upper and lower sides after rolling, thereby realizing fixing.

[0038] Compared with the existing welding processing method, the heat sink 11 does not need thermal processing, but only needs rolling processing, thereby simplifying the processing tech...

Embodiment 2

[0045] On the basis of Embodiment 1, it is also possible to Figure 9 and Figure 10 As shown, a boss 23 is provided on one side of the heat sink 21 , and the heat pipe 24 is supported by a supporting structure 22 on the other side. The supporting structure 22 is arranged on the side wall of the heat pipe groove close to the lower surface of the heat sink 21 and extends toward the center of the heat pipe groove. Preferably, in order to better contact the heat sink 21 with the heat pipe 24 , the surface of the supporting structure 22 used for contacting the heat pipe 24 can be processed into a curved surface close to the shape of the heat pipe 24 . The supporting structure 22 can be processed and formed when the heat pipe groove is stamped. This structure can also achieve the same overall thickness after rolling.

[0046] On the basis of Embodiment 1 and Embodiment 2, further deformation and optimization can be performed. For example, the boss can be perpendicular to the su...

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PUM

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Abstract

The invention provides a radiating fin, a radiating structure and a processing method.The radiating fin is provided with a heat pipe groove used for containing a heat conduction pipe, and the two sides of the heat pipe groove are provided with a plurality of bosses used for riveting the heat conduction pipe; and the plurality of bosses comprise a first type of bosses higher than the upper surfaces of the radiating fins and a second type of bosses higher than the lower surfaces of the radiating fins. The heat pipe grooves are formed in the cooling fins, the bosses are arranged on the two sides of the heat pipe grooves, the heat conduction pipes can be riveted in the cooling fins, the overall thickness of the heat conduction pipes is still the same as that of the cooling fins, and therefore the overall thickness of the heat dissipation structure is smaller, and meanwhile the heat dissipation performance is good.

Description

technical field [0001] The invention relates to heat dissipation technology, in particular to a heat dissipation fin, a heat dissipation structure and a processing method. Background technique [0002] With the improvement of people's living standards and fashion aesthetics, light, thin, short, and small have also become the development trend of various technological products. In this context, heat sinks are getting thinner and thinner, and the requirements for heat dissipation performance are getting higher and higher. [0003] At present, the light and thin heat sinks on the market are mainly based on ultra-thin heat pipes, VC liquid cooling and other methods. The manufacturing process of VC liquid cooling is complicated and the cost is high. However, during the welding process of the ultra-thin heat pipe and the heat sink, welding defects are virtually increased, which affects the heat dissipation effect. [0004] The applicant's prior patent CN202011435953.2 provides a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 李磊闫晓峰
Owner LIANDE ELECTRONIC TECH (CHANGSHU) CO LTD