Virtual simulation platform based on cushion packaging design

A technology of virtual simulation and buffer packaging, applied in the field of virtual simulation, can solve the problems of limited application of data processing buffer design, students cannot operate by themselves, insufficient buffer packaging, etc., to avoid various uncertain factors, ease teaching pressure, and facilitate The effect of review

Pending Publication Date: 2022-04-22
TIANJIN UNIVERSITY OF SCIENCE AND TECHNOLOGY
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Problems solved by technology

[0003] At present, in many colleges and universities offering packaging, the subject of transportation packaging is generally offered, especially cushioning packaging as the focus of the course. The dynamic cushioning performance test of cushioning packaging materials is demonstrated, and students cannot operate it by themselves, and the application of later experimental data processing and cushioning design is limited, resulting in students' lack of understanding of cushioning packaging, and there may also be safety problems in the later stage

Method used

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  • Virtual simulation platform based on cushion packaging design
  • Virtual simulation platform based on cushion packaging design
  • Virtual simulation platform based on cushion packaging design

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] The purpose of the present invention is to provide a virtual simulation platform based on the cushioning packaging design, which is used to provide a new teaching method for the cushioning packaging test and enhance students' understanding.

[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying d...

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Abstract

The invention discloses a buffer package design-based virtual simulation platform, which comprises a data source module, a visual three-dimensional module and a virtual simulation display interface module, and is characterized in that the data source module provides data and method support for the virtual simulation display interface module, and the visual three-dimensional module provides model support for the virtual simulation display interface module. The buffer package design-based virtual simulation platform provided by the invention is used for providing a new teaching mode for a buffer package test and enhancing the understanding of students.

Description

technical field [0001] The invention relates to the technical field of virtual simulation, in particular to a virtual simulation platform based on buffer packaging design. Background technique [0002] With the development of virtual simulation technology becoming more and more mature, it has been introduced in many fields. In recent years, colleges and universities have made a lot of investment in experimental teaching reform and practical teaching content. Especially since the epidemic, the teaching method has gradually changed from traditional offline teaching to online teaching. For practical courses, virtual simulation technology has gradually demonstrated its irreplaceable advantages and functions at this stage. [0003] At present, in many college courses offering packaging, the subject of transportation packaging is generally offered, especially cushioning packaging as the focus of the course. The dynamic cushioning performance test of cushioning packaging material...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/20G06T17/00G09B5/02G06F9/451G06F111/10
CPCG06F30/20G06T17/00G09B5/02G06F9/451G06F2111/10
Inventor 司占军王瑾
Owner TIANJIN UNIVERSITY OF SCIENCE AND TECHNOLOGY
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