Airflow-improved wafer cleaning system and working method thereof

Abstract

The invention discloses a wafer cleaning system with improved airflow and a working method thereof, and the wafer cleaning system with improved airflow comprises an isolation chamber; the cleaning unit is arranged in the isolation chamber, the cleaning unit communicates with the isolation chamber, and the cleaning unit is used for cleaning the wafer; the air input unit and the air output unit are used for inputting clean air to the top of the isolation chamber; the gas discharging unit is used for discharging gas at the inner bottom of the cleaning unit; and the nitrogen input unit is used for inputting nitrogen into the cleaning unit. Through the application of the wafer cleaning device, the internal airflow of the cleaning unit in the isolation chamber is kept in a relatively stable state under the cooperation of the air input unit, the gas exhaust unit and the nitrogen input unit, so that the cleaning liquid for wafer cleaning is difficult to crystallize and accumulate in the wafer cleaning process, and the wafer cleaning efficiency is improved. And the cleaning quality of the wafer is further improved.

Description

technical field [0001] The invention relates to the technical field of wafer cleaning, in particular to a wafer cleaning system with improved airflow and a working method thereof. Background technique [0002] In the existing single-chip wafer cleaning equipment, the method of cooperating with the cavity and other spraying devices is usually used to clean the surface of the wafer. During this process, the wafer is in a state of high-speed rotation, and the spraying device sprays The sprayed cleaning liquid diffuses on the surface of the wafer and is thrown out. At the same time, a corresponding air blowing structure is provided in the cavity to cooperate with the cleaning work of the wafer. However, for the existing wafer cleaning equipment, there is a change in the airflow due to the work of the air blowing structure inside it, and this change in the airflow will easily cause the cleaning liquid to be deposited at the edge of the wafer during the rotation of the wafer. And...

AI Technical Summary

Problems solved by technology

However, for the existing wafer cleaning equipment, there is a change in the airflow due to the work of the air blowing structure inside it, and this change in the airflow will easily cause the cleaning liquid to be deposited at the edge of the wafer during the rotation of the wafer. And the accumulation of crystals on the inner wall of the chamber affects the normal operation of wafer cleaning

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