Positioning and fixing equipment for chip packaging
A technology of fixed equipment and chip packaging, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problems of complicated operation and long time-consuming, and achieve the effect of good installation and convenient positioning
Pending Publication Date: 2022-04-29
沈阳臻美科技有限公司
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Problems solved by technology
[0005] Chip packaging is installed and packaged step by step according to the process, the operation is complicated and time-consuming
Method used
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[0023] The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, further describe the technical solution of the present invention, but these embodiments.
[0024] Such as figure 1 As shown, a positioning and fixing device for chip packaging includes a housing 10, two symmetrical conveying chambers 11 are provided on the upper end wall of the housing 10, a compression air device is provided on the conveying chamber 11, and a The chip control board 23 is provided with a release bonding device, the lower end of the housing 10 is provided with a working chamber 13, the working chamber 13 is provided with a transmission protection device, and the lower end wall of the working chamber 13 is provided with a clamping upper support device, the compressed air device includes a main control board 12 fixed on the upper end wall of the housing 10, an induction plate 22 is arranged on the lower end wall of the main control board 12, a...
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The invention belongs to the field of chip packaging, and relates to chip packaging positioning and fixing equipment which comprises a shell, two symmetrical conveying cavities are formed in the upper end wall of the shell, compression and air compression devices are arranged on the conveying cavities, a chip control panel is arranged between the conveying cavities, and the chip control panel is provided with a chip fixing device. A release bonding device is arranged on the chip control board, and a conveying protection device is arranged on the working cavity. According to the invention, the chip can be effectively processed, the front end of the chip can be bonded, the integrity of the chip can be protected, the gluing equipment can be inflated and pressed down, the lead angle of the chip can be effectively pressed down for the second time, the lead angle can be effectively glued after being positioned, meanwhile, glue can be effectively saved, closing can be carried out at any time, and the production efficiency can be improved. According to the invention, the positioning is more accurate, each lead angle can be effectively glued, the mainboard is positioned and supported at the same time, the chip is helped to be better installed, and the positioning is more convenient through the upper support.
Description
technical field [0001] The invention belongs to the field of chip packaging, in particular to a positioning and fixing device for chip packaging. Background technique [0002] As we all know, the shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge between the internal world of the chip and the external circuit - the contacts on the chip are connected to the package by wires On the pins of the shell, these pins are connected to other devices through the wires on the printed board. Therefore, packaging plays an important role for both CPUs and other LSI integrated circuits. [0003] When the chip is packaged, the precise positioning of the secondary compression cannot be performed, and the effective gluing cannot be performed during the compression. [0004] When the chip package is supported and positioned, it cannot effectively s...
Claims
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IPC IPC(8): H01L21/67H01L21/68
CPCH01L21/67144H01L21/68
Inventor 包长林
Owner 沈阳臻美科技有限公司