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A lead frame die switching device

A lead frame and mold technology, which is applied in the field of lead frame mold switching devices, can solve the problems of lack of shock buffer, errors, and inability to switch quickly and automatically, and achieve the effect of improving processing efficiency and ensuring processing accuracy.

Active Publication Date: 2022-07-01
NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems in the prior art such as the inability to switch quickly and automatically, the existence of errors, and the lack of impact buffering, etc., and propose a lead frame die switching device

Method used

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  • A lead frame die switching device
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  • A lead frame die switching device

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Embodiment Construction

[0028] refer to Figure 1-6 , a lead frame die switching device, the main body seat 1, the upper surface of the main body seat 1 is slidably connected with a sliding plate 2, the upper surface of the sliding plate 2 is detachably connected with three stamping dies 42, and the three stamping dies 42 are detachably connected by bolts , so that the mold can be freely replaced according to needs, and the switching between different molds is completed. The upper surface of the main body seat 1 is provided with a stamping device 44, and the stamping device 44 is composed of a hydraulic cylinder and a stamping head, which is the prior art, and will not be repeated here. , the main body seat 1 is provided with a quick switching mechanism;

[0029]The quick switching mechanism includes a sliding groove 3 opened in the main body base 1, a sliding block 4 is slidably connected in the sliding groove 3, the sliding block 4 is fixedly connected with the lower surface of the sliding plate 2,...

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Abstract

The invention discloses a lead frame die switching device, a main body seat, a sliding plate is slidably connected on the upper surface of the main body seat, three molds are detachably connected on the upper surface of the sliding plate, and a punching plate is arranged on the upper surface of the main body seat The main body seat is provided with a quick switching mechanism; the quick switching mechanism includes a sliding groove opened in the main body seat, and a sliding block is slidably connected in the sliding groove, and the sliding block is connected to the lower surface of the sliding plate. Fixed connection, two sliding sleeves are fixedly connected through the main body seat, and connecting blocks are sealed and slidably connected in the sliding sleeve, and the two connecting blocks are respectively fixedly connected with the two side walls opposite to the slider. The advantages are: the switching device of the present invention can quickly switch the mold in the continuous high-speed stamping process, thereby improving the processing efficiency, and the position of the mold after switching is accurate, ensuring the processing quality, and at the same time, it can buffer part of the stamping process. impulse, protective device.

Description

technical field [0001] The invention relates to the technical field of lead frame processing, in particular to a lead frame die switching device. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural member that realizes the electrical connection between the terminal of the internal circuit of the chip and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. During the production and processing of lead frames, the lead frame is shaped by stamping. Processing, and different shapes require different dies for stamping, using a switching device to the dies. [0003] In the prior art, the existing mold switching devices often need to manually switch afte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D22/06B30B15/00B21C51/00
CPCB21D22/06B30B15/0076B21C51/00
Inventor 潘龙慧李勇冯军民詹桂平
Owner NINGBO DEZHOU PRECISION ELECTRONIC CO LTD
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