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Electroplating system

A technology of electroplating solution and electroplating workers, applied in electrolytic components, electrolytic process, cells, etc., can solve the problems of poor uniformity of electroplating, unstable flow of electroplating solution, etc., and achieve the effect of improving uniformity and stability

Pending Publication Date: 2022-05-06
CHINA INSTITUTE OF ATOMIC ENERGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In related technologies, the electroplating system is still immature, for example, the flow of electroplating solution in the electroplating station is unstable, and there is a problem of poor electroplating uniformity

Method used

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Embodiment Construction

[0034] It should be noted that the embodiments / embodiments provided in this application can be combined with each other without contradiction. The detailed description in the specific embodiment shall be understood as an explanation of the purpose of this application and shall not be regarded as an improper restriction on this application.

[0035]In the description of the application, it should be understood that these orientation terms are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so they cannot be understood as restrictions on the application.

[0036] For slender pipe fittings whose inner and outer walls need uniform electroplating, the electroplating solution circulation system in relevant domestic technologies is not mature. For example, the electroplating degree of inner a...

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Abstract

The invention relates to the technical field of electroplating, and discloses an electroplating system which comprises a plurality of electroplating stations, a liquid storage device, an infusion pump and a pressure stabilizing device, the electroplating stations are used for containing electroplating liquid so as to electroplate workpieces to be electroplated, the liquid storage device communicates with the electroplating stations, the infusion pump communicates between the liquid storage device and the electroplating stations, and the pressure stabilizing device is used for stabilizing the pressure of the liquid storage device. And the pressure stabilizing device is communicated between the infusion pump and the plurality of electroplating stations and is used for reducing the change of the flow velocity of the electroplating liquid caused by the instantaneous flow resistance change generated in the electroplating stations to the adjacent electroplating stations. According to the electroplating system, the pressure stabilizing device is arranged in the electroplating system and is communicated between the infusion pump and the electroplating stations, so that the change of the flow velocity of electroplating liquid, caused by the instantaneous flow resistance change generated when to-be-electroplated workpieces of different electroplating stations are mounted and dismounted, on the adjacent electroplating stations can be reduced; according to the electroplating system, the stability of the electroplating environment and the flow speed of the electroplating liquid can be improved, and then the electroplating uniformity of the to-be-electroplated workpiece can be improved.

Description

technical field [0001] The application relates to the technical field of electroplating, in particular to an electroplating system. Background technology [0002] In the electroplating process, the uniformity of the coating on the surface of the workpiece to be plated is an important factor to judge the level of the electroplating process, and the uniformity of the coating is closely related to the placement of the workpiece to be plated in the electroplating solution and the circulation of the electroplating solution. In related technologies, the electroplating system is not mature. For example, the flow of electroplating solution in the electroplating station is unstable, and there is the problem of poor electroplating uniformity. summary of the invention [0003] In view of this, the embodiment of the present application expects to provide an electroplating system to improve the uniformity of electroplating. [0004] The present application provides an electroplating system f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D21/12
CPCC25D17/00C25D21/12
Inventor 杨洪广王玮何长水袁晓明郭炜韩志博白宪璐丁卫东
Owner CHINA INSTITUTE OF ATOMIC ENERGY
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