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Heat dissipation structure for vapor chamber

A heat dissipation structure and uniform temperature plate technology, which is applied in the directions of instruments, calculations, digital processing power distribution, etc., can solve the problems of computer performance impact, inconvenient cleaning, and reduced heat dissipation efficiency of heating elements, etc., to achieve easy disassembly, cleaning and replacement, and easy installation and the effect of disassembly

Pending Publication Date: 2022-05-10
苏州生益兴热传科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most of the existing vapor chambers and heat dissipation structures are designed in one piece. After a long time of use, dust will inevitably accumulate on the surface of the heat dissipation structure, which is not easy to clean. This will reduce the heat dissipation efficiency of the heating elements inside the computer, and further make the computer's The performance is affected; therefore, a heat dissipation structure for the vapor chamber is proposed to address the above problems

Method used

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  • Heat dissipation structure for vapor chamber
  • Heat dissipation structure for vapor chamber
  • Heat dissipation structure for vapor chamber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] see Figure 1-4 As shown, a heat dissipation structure for a vapor chamber includes a chamber body 1 and heat dissipation fins 2; the top of the chamber body 1 is provided with a heat dissipation fin 2, and the heat dissipation fin 2 and A connection mechanism is provided between the temperature plate main bodies 1; the connection mechanism includes a connection block 31, a connection groove 32, a slot 33, a block 34, a connection cavity 35, a return spring 36, a sliding assembly and an auxiliary connection assembly. The block 31 is inserted inside the connecting groove 32, the connecting groove 32 is set on both sides of the top of the chamber body 1, the clamping groove 33 is set on one side of the bottom end of the connecting block 31, one of the clamping blocks 34 One side is engaged with the clamping groove 33, and the other side of the clamping block 34 is sleeved in the inside of the clamping cavity 35, the clamping cavity 35 is provided on one side of the connec...

Embodiment 2

[0042] see Figure 5 As shown, compared with Example 1, as another embodiment of the present invention, a clamping block 44 is provided at a position close to the center of the connecting block 31 away from the slot 42, and the clamping block 44 and the clamping groove 45, the snap-in groove 45 is fixedly connected to the inside of the connection groove 32, and the snap-in groove 45 is made of rubber material; when working, when the connection block 31 is inserted into the inside of the connection groove 32, the connection block 31 is connected to the snap-in groove 45 is squeezed, so that the clamping groove 45 made of rubber material is elastically deformed. When the connecting block 31 is fully inserted into the inside of the connecting groove 32, the pressing force of the connecting block 31 on the clamping groove 45 disappears. At this time, the clamping groove 45 returns to its original state under the action of its own reducing force and engages with the clamping block ...

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Abstract

The invention belongs to the field of uniform temperature plates, and particularly relates to a heat dissipation structure for a uniform temperature plate, which comprises a uniform temperature plate main body and heat dissipation fins, heat dissipation fins are arranged at the top end of the temperature-uniforming plate main body, and a connecting mechanism is arranged between the heat dissipation fins and the temperature-uniforming plate main body; the connecting mechanism comprises a connecting block, a connecting groove, a clamping groove, a clamping block, a clamping cavity, a reset spring, a sliding assembly and an auxiliary connecting assembly, the connecting block is inserted into the connecting groove, the connecting groove is formed in the two sides of the top end of the vapor chamber main body, the clamping groove is formed in one side of the bottom end of the connecting block, one side of the clamping block is clamped with the clamping groove, and the clamping cavity is formed in the top end of the vapor chamber main body. And the other side of the clamping block is arranged in the clamping cavity in a sleeved mode, the clamping cavity is formed in one side of the interior of the connecting groove, the reset spring is arranged in the clamping cavity, the sliding assembly is arranged between the clamping block and the inner wall of the clamping cavity, and the effect of conveniently connecting the cooling fins and the uniform temperature plate body is achieved through the effect of the connecting mechanism.

Description

technical field [0001] The invention relates to the field of uniform temperature plates, in particular to a heat dissipation structure for a temperature uniform plate. Background technique [0002] With the development of science and technology, while the performance of the computer has been continuously improved, the heat generation has also been greatly improved. In order to prevent the components inside the computer from being damaged due to overheating, the vapor chamber came into being. [0003] With the continuous increase of the heat generated by the computer, the vapor chamber has also been continuously improved. Compared with the previous vapor chamber, the heat conduction efficiency of the existing vapor chamber has been greatly improved. [0004] Most of the existing vapor chambers and heat dissipation structures are designed in one piece. After a long time of use, dust will inevitably accumulate on the surface of the heat dissipation structure, which is not easy ...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/20G06F1/183
Inventor 徐如松夏冬冬李建伟
Owner 苏州生益兴热传科技有限公司