Ring taking device and method
An auxiliary device and edge ring technology, which is applied in grinding devices, grinding machine tools, metal processing equipment, etc., can solve the problems of high risk, low ring removal efficiency, and long time consumption.
Inactive Publication Date: 2022-05-27
SEMICON MFG ELECTRONICS (SHAOXING) CORP
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Problems solved by technology
[0004] However, the upward lifting ring removal method is likely to cause instability to the wafer, causing the wafer to be scrapped due to cracks; moreover, the entire ring removal process needs to be divided into two parts, which takes a long time and the overall ring removal efficiency is low. The overall risk of the ring process is higher
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[0041] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the related drawings. Embodiments of the present application are presented in the accompanying drawings. However, the application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are for the purpose of describing specific embodiments only, and are not intended to limit the application.
[0043] It will be understood that the terms "first", "second", etc. used in this application may be used herein to describe various fea...
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The invention relates to a ring taking device and method. The ring taking device comprises a working platform which is used for fixing the part, except the edge ring, of the to-be-taken ring wafer and driving the to-be-taken ring wafer to rotate; and the debonding device is used for enabling the viscosity between the edge ring and the adhesive film to be lost, so that the edge ring is separated from the to-be-taken ring wafer in a downward falling mode. According to the ring taking device, the original crack of the to-be-taken ring wafer can be prevented from being deepened, so that the problem that the to-be-taken ring wafer is scrapped due to the crack in the ring taking process is not easy to occur; the edge ring is separated from the to-be-taken ring wafer in a downward falling mode, so that even if the edge ring is broken in the ring taking process, the edge ring can directly fall without influencing the to-be-taken ring wafer, the edge ring and the to-be-taken ring wafer are separated while the edge ring and the adhesive film are not bonded, the time required for taking the ring can be shortened, the overall ring taking efficiency is improved, and the production cost is reduced. And the overall risk in the ring taking process is reduced.
Description
technical field [0001] The present application relates to the field of semiconductor integrated circuit manufacturing, and in particular, to a ring taking device and method. Background technique [0002] Taiko thinning process is an ultra-thin thinning process developed by Japanese DISCO company. Taiko thinning process only thins the middle part of the back of the wafer, and does not grind the edge part of the wafer. thin, and an edge ring (ring) is formed by the edge portion that is not thinned. [0003] After the wafers processed by Taiko thinning process are mounted on the backside, the edge ring needs to be removed to facilitate the next process. At present, the commonly used technique is to lift the ring upward, and the whole ring removal process is divided into two parts: ultraviolet (Ultraviolet, UV) degumming and ring removal. [0004] However, the upward lifting method of taking the ring is easy to cause instability to the wafer, so that the wafer is scrapped due ...
Claims
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IPC IPC(8): B24B37/34B24B37/10
CPCB24B37/345B24B37/10
Inventor 谢吉余杨轩毅任瑞
Owner SEMICON MFG ELECTRONICS (SHAOXING) CORP