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CMOS color image sensor with metamaterial color separation

A void, 3D technology applied in the field of image sensors

Pending Publication Date: 2022-05-27
CALIFORNIA INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with this image sensor is that the efficiency is limited to around 30% because most of the light is absorbed

Method used

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  • CMOS color image sensor with metamaterial color separation
  • CMOS color image sensor with metamaterial color separation
  • CMOS color image sensor with metamaterial color separation

Examples

Experimental program
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Embodiment Construction

[0028] Figure 2A An image sensor (200) according to an embodiment of the present disclosure is shown. The image sensor (200) includes a three-dimensional (3D) scattering structure (201) that acts as a spectral splitter. The 3D scattering structure (201) includes a plurality of dielectric pillars (205) formed to scatter light in a predetermined pattern. Incident light (202) passing through the 3D scattering structure (201) is scattered away by the dielectric pillars. By arranging the dielectric pillars (205) according to one or more target functions, the scattering pattern is tailored to perform the desired function. As an example, a 3D scattering structure (201) can be designed as a beam splitter to simultaneously classify and focus incident light (202) into any number of wavelengths (λ 1 ,…,λ n ), each of which is directed to a single pixel on the focal plane (203) below the 3D scattering structure (201), as Figure 2A shown. According to embodiments of the present dis...

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PUM

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Abstract

Methods of constructing multifunctional scattering structures while complying with the strict requirements imparted by the manufacturing process are described. The described methods and apparatus are based on etching off a network of wires embedded in a 3D structure to form voids, thereby performing an objective function. The invention further discloses an optimization algorithm for designing the binary device meeting the manufacturing requirements.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application is related to US Patent No. 16 / 656,156, filed October 17, 2019, entitled "Color And Multi-Spectral Image Sensor Based On 3D Engineered Material" (Att. Docket No. P2404-US), the contents of which are incorporated by reference in their entirety. this. [0003] Government Grant Statement [0004] This invention was made with government funding awarded by DARPA under grant number HR0011-17-2-0035. The government has certain rights in this invention. technical field [0005] The present disclosure relates to image sensors, and more particularly, to metamaterial spectrum splitters fabricated using CMOS fabrication techniques. Background technique [0006] Optical systems are often designed through modular combinations of components to achieve complex functions. For example, lenses and diffractive optics can be combined for hyperspectral imaging. This approach is intuitive and flexible, allowing access to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/02G02B1/00
CPCG02B5/0247G02B5/0268G02B5/0278
Inventor G.罗伯茨P.卡迈德-穆诺兹C.巴卢A.法拉昂
Owner CALIFORNIA INST OF TECH