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Positioning mechanism for dispensing processing of electronic component

A technology for electronic components and positioning mechanisms, which is applied in cleaning methods and appliances, chemical instruments and methods, cleaning methods using gas flow, etc., and can solve problems such as inconvenient rapid positioning and adjustment

Inactive Publication Date: 2022-05-31
陈东强
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, this application proposes a positioning mechanism for dispensing processing of electronic components to solve the problem that the electronic components are placed on the plate with positioning grooves when the dispensing machine in the related art performs dispensing operations on electronic components. However, the orientation of the board at the bottom of the electronic components in the horizontal position is not convenient for quick positioning and adjustment

Method used

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  • Positioning mechanism for dispensing processing of electronic component
  • Positioning mechanism for dispensing processing of electronic component
  • Positioning mechanism for dispensing processing of electronic component

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Embodiment Construction

[0044] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0045] In order to make the purposes, technical solutions and advantages of the embodiments of the application clearer, the technical solutions in the embodiments of the application will be clearly and completely described below in conjunction with the drawings in the embodiments of the application. Obviously, the described embodiments It is a part of embodiment of this application, and is not all embodiment. Based on the implementation manners in this application, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

[0046] Accordingly, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope ...

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Abstract

The embodiment of the invention provides a positioning mechanism for dispensing processing of electronic components, and relates to the technical field of dispensing positioning mechanisms. The positioning mechanism for dispensing processing of the electronic component comprises a bottom moving supporting part and a device positioning part. The bottom moving supporting part comprises a bottom plate, a first driving assembly, first bearing seats, a lead screw, a lead screw seat and a supporting frame, the two first bearing seats are installed on the two sides of the upper surface of the bottom plate correspondingly, and the two ends of the lead screw are installed on the inner rings of the two first bearing seats correspondingly. The second driving assembly drives the transmission shaft to rotate, the rotating transmission shaft drives the rotating connecting assembly to rotate, and the rotating rotating connecting assembly drives the connecting plate to transversely move above the operation table plate, that is, the electronic components above the device placing plate are driven to move and adjust in the transverse position. Through the process, the electronic component above the device placing plate can be quickly moved, positioned and adjusted in the longitudinal position and the transverse position.

Description

technical field [0001] The present application relates to the technical field of glue dispensing positioning mechanism, in particular, to a positioning mechanism for dispensing and processing of electronic components. Background technique [0002] Electronic components include: resistors, capacitors, inductors, potentiometers, electronic tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro Special motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystal, quartz, ceramic magnetic materials, substrate substrates for printed circuits, etc. [0003] Electronic components need to use dispensing equipment during dispensing processing. When the dispensing machine in the related art performs dispensing operations on electronic components, the el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C13/02B08B5/02B08B15/02
CPCB05C13/02B08B5/02B08B15/02
Inventor 陈东强
Owner 陈东强
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