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LED chip processing device

A technology for LED chips and processing devices, which is applied to devices for coating liquid on the surface, coatings, semiconductor devices, etc., and can solve the problems of glue dropping, glue dropping and molding at the same time, and low processing efficiency.

Pending Publication Date: 2022-06-03
黄应超
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that part of the cured glue will enter the glue dropping in the existing glue sealing step, which affects the effect of glue sealing, and the glue dropping and compression molding cannot be carried out at the same time, and glue dropping and molding must be carried out on different equipment. Compression mold, which leads to the problem of low processing efficiency, and a LED chip processing device proposed

Method used

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  • LED chip processing device
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Examples

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Embodiment Construction

[0020] The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0021] refer to Figure 1-4 , an LED chip processing device, comprising a base 1, the top wall of the base 1 is fixedly connected to a top plate 4 through a support plate 3, the bottom wall of the top plate 4 is fixedly connected to a trapezoidal plate 5, the inner wall of the top plate 4 is fixedly connected to a motor 6, and the output of the motor 6 The end is fixedly connected with a U-shaped rod 8, the bending part of the U-shaped rod 8 is rotatably connected with a first push rod 9, the bottom wall of the top plate 4 is slidably connected with a folding plate 10, and the first push rod 9 is away from the end of the U-shaped rod 8 and The inner wall of the folded plate 10 is rotatably connected, the inner wall of the folded plate 10 is rotatably connected with a rotating shaft 17, one end of the rotating shaft 17 is fixedly connected with a connecti...

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PUM

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Abstract

The invention relates to the technical field of chip glue sealing, in particular to an LED chip processing device which comprises a base, the top wall of the base is fixedly connected with a top plate through a supporting plate, the bottom wall of the top plate is fixedly connected with a trapezoidal plate, the inner wall of the top plate is fixedly connected with a motor, the output end of the motor is fixedly connected with a U-shaped rod, and the bent part of the U-shaped rod is rotationally connected with a first push rod. A rotating shaft is rotatably connected to the inner wall of the folded plate in a penetrating mode, a connecting rod is fixedly connected to one end of the rotating shaft, a rotating wheel is fixedly connected to the end, away from the rotating shaft, of the connecting rod, the rotating wheel abuts against the trapezoidal plate in a sliding mode, and an L-shaped rod is fixedly connected to the inner wall of the folded plate. By arranging the trapezoidal plate, the rotating wheel, the U-shaped rod and other structures, when the glue dripping pipe is in a horizontal state, residual glue in the glue dripping pipe is pumped away, and the situation that the glue dripping and sealing effect is affected due to the fact that the residual glue in the glue dripping pipe makes contact with air and is partially solidified is avoided.

Description

technical field [0001] The invention relates to the technical field of chip encapsulation, in particular to an LED chip processing device. Background technique [0002] The main function of the LED chip is to convert electrical energy into light energy, and the main material of the chip is monocrystalline silicon. During the production and processing of the LED chip, when the glue sealing step is performed, after the glue dispenser performs one drop of glue, the glue remaining at the end of the glue drop tube contacts with the air, which will cause partial curing. During the glue dispensing process, some cured glue will enter the glue, which affects the sealing effect, and the glue dispensing and compression cannot be carried out at the same time, and the glue and compression need to be carried out on different equipment, and the processing efficiency is low. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to solve the problem that partially cure...

Claims

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Application Information

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IPC IPC(8): H01L33/52H01L33/48B05C5/02B05C11/10
CPCH01L33/52H01L33/48B05C5/0208B05C11/1039H01L2933/0033H01L2933/005Y02P70/10
Inventor 黄应超
Owner 黄应超