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High-precision laser cutting equipment for mobile phone film

A technology of laser cutting and mobile phone film, applied in laser welding equipment, welding/cutting auxiliary equipment, welding equipment, etc., to save cutting materials, reduce costs, and protect the environment

Active Publication Date: 2022-06-07
SHENZHEN LIHENGMEI ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-precision laser cutting equipment for mobile phone film to solve the problems mentioned in the above process

Method used

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  • High-precision laser cutting equipment for mobile phone film
  • High-precision laser cutting equipment for mobile phone film
  • High-precision laser cutting equipment for mobile phone film

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Embodiment Construction

[0041] Features and exemplary embodiments of various aspects of the invention are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present invention by illustrating examples of the invention. The present invention is in no way limited to any specific configurations and algorithms set forth below, but covers any modification, substitution and improvement of elements, components and algorithms without departing from the spirit of the invention. In the drawings and the following description, well-known structures and techniques have not been shown in order to avoid unnecessarily obscuring the present invention.

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Abstract

The invention relates to the technical field of laser cutting, in particular to high-precision laser cutting equipment for a mobile phone film. The flattening assembly is located on one side of the inner end of the laser cutting assembly, and the laser cutting assembly comprises an equipment shell, a control panel, an observation window, cooling fins, a feeding port, a first electric guide rail, a laser cutter, a plate matching platform, a side wing guide groove, an electric control guide block and a bringing-in clamping groove. According to the mobile phone film cutting device, the mobile phone film can not move all the time after being placed, meanwhile, the mobile phone film is shaped and cut by moving the laser cutting assembly and the mobile phone film placing plate, and therefore the mobile phone film can be effectively prevented from moving in the cutting process; therefore, the shaping and cutting quality of the mobile phone film can be ensured; the phenomenon that wrinkles appear on the mobile phone film can be prevented, and normal cutting of the mobile phone film is prevented from being affected by the wrinkles of the mobile phone film.

Description

technical field [0001] The invention relates to the technical field of laser cutting, in particular to a high-precision laser cutting device for mobile phone films. Background technique [0002] Laser cutting uses a high-energy-density laser beam to heat the workpiece, so that the temperature rises rapidly, reaching the boiling point of the material in a very short time, and the material begins to vaporize to form vapor. These vapors are ejected at a high speed, and at the same time as the vapors are ejected, incisions are formed on the material. Laser cutting equipment is widely used. cutting equipment. [0003] The current laser cutting equipment for mobile phone film has the following problems: the position of the mobile phone film cannot be uniquely fixed, so that the mobile phone film is cut in constant movement. Since the mobile phone film is continuously moved for cutting, the mobile phone film is prone to slippage. This phenomenon causes a great deviation in the cu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/70B23K37/04
CPCB23K26/38B23K26/702B23K37/0408Y02P70/10
Inventor 张小平魏方敏
Owner SHENZHEN LIHENGMEI ELECTRONIC TECH CO LTD
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