USB conversion chip link structure and PCB
A technology for converting chip and link structures, applied in instruments, electrical digital data processing, etc., can solve problems such as increased design risk, multi-PCB space, and signal quality impact, so as to reduce impedance discontinuity effect, ensure correct interconnection, reduce Effects of Signal Integrity Issues
Inactive Publication Date: 2022-06-21
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Although this design method meets the design requirements of USB, because the signal needs to be changed twice, two vias are added in the link, which not only takes up more PCB space, but also introduces additional impedance discontinuities, which is harmful to the signal. Quality impacts, increases design risk
Method used
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Embodiment 1
[0034] The USB I / O interface chip and the USB conversion chip are located on different layers of the PCB board or on the same layer of the PCB board, and the distance between them is greater than a threshold. The USB I / O interface chip and the USB conversion chip communicate through differential signals, and via holes are arranged on the connection link between the USB I / O interface chip and the USB conversion chip. Specifically, the lower side of the USB conversion chip is provided with a common terminal signal port, and the common terminal signal port includes a common terminal differential signal negative terminal on the left and a common terminal differential signal positive terminal on the right. The USB I / O interface chip is provided with an I / O signal port, and the I / O signal port includes an I / O differential signal positive port and an I / O differential signal negative port. The negative port of the differential signal of the common end is connected to the negative port...
Embodiment 2
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The invention relates to the field of USB conversion chip links, and particularly discloses a USB conversion chip link structure and a PCB, a first USB conversion differential signal negative port on the upper side of the right side edge of a USB conversion chip is connected with a first target differential signal negative port on the left side of the upper side edge of a first target chip through routing on a PCB layer where the USB conversion chip is located; a first USB conversion differential signal positive electrode port on the lower side of the right side edge of the USB conversion chip is connected with a first target differential signal positive electrode port on the other side of the upper side edge of the first target chip through routing on the PCB layer where the USB conversion chip is located. According to the invention, the DP and DN polarities of the USB conversion chip are reversed, so that signal layer change between the USB conversion chip and other chips is avoided, the space utilization rate of a board card is improved, the number of link via holes is reduced, the signal quality is improved, and the system design risk is reduced.
Description
technical field [0001] The invention relates to the field of USB conversion chip links, in particular to a USB conversion chip link structure and a PCB board. Background technique [0002] In PC (Personal Computer, personal computer) design, system configurations are becoming more and more diverse. For example, for USB links, some customers require that they support keyboard power-on functions. In this case, motherboard designers will select different channels at different stages by adding USB conversion chips. For example, in the initial stage of system power-on, the USB conversion chip connects the USB I / O interface chip to the MCU chip, and the signal sent by the keyboard is transmitted to the MCU chip through the USB I / O interface chip, and the MCU chip assists in the boot operation. After the system is turned on, the USB conversion chip connects the USB I / O interface chip with the CPU chip to realize normal signal transmission between the USB I / O interface chip and the...
Claims
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IPC IPC(8): G06F13/38
CPCG06F13/385G06F2213/0042
Inventor 荣世立李岩
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD