Pick-and-place structure, die bonding equipment and working method of die bonding equipment

A technology of solid crystal and worktable, which is applied in semiconductor/solid-state device manufacturing, electrical components, conveyor objects, etc., can solve problems such as low production efficiency, and achieve the effect of improving production efficiency, improving work quality, and shortening time.

Pending Publication Date: 2022-06-24
深圳市昌富祥智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the defect of low production efficiency existing in the prior art, the present invention provides a pick-and-place structure and crystal bonding equipment

Method used

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  • Pick-and-place structure, die bonding equipment and working method of die bonding equipment
  • Pick-and-place structure, die bonding equipment and working method of die bonding equipment
  • Pick-and-place structure, die bonding equipment and working method of die bonding equipment

Examples

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Embodiment

[0033] Example: as Figure 1-3 As shown in the figure, a pick-and-place structure and crystal-bonding equipment of the present invention includes a workbench 1, and two ends of the workbench 1 are symmetrically provided with a pick-and-place crystal-fixing mechanism 2. The spindle rotating motor 3 and the mounting frame 4 arranged under the worktable 1, the output end of the spindle rotating motor 3 is inserted through the worktable 1 and connected to the mounting frame 4, the two sides of the mounting frame 4 are symmetrically provided with a voice coil motor 5, and the voice coil The output end of the motor 5 is provided with a mounting seat 6, and the mounting seat 6 is provided with a swing arm 7. The two voice coil motors 5 and the two swing arms 7 are symmetrically distributed on both sides of the lower part of the working platform 2 with the spindle rotating motor 3 as the axis. , By using the double swing arm 7 to move alternately, the time is shortened and the product...

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PUM

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Abstract

The invention discloses a pick-and-place structure and die bonding equipment, the pick-and-place structure comprises a workbench, pick-and-place die bonding mechanisms are symmetrically arranged at two ends of the workbench, each pick-and-place die bonding mechanism comprises a main shaft rotating motor arranged above the workbench and a mounting rack arranged below the workbench, and the output end of each main shaft rotating motor penetrates through the workbench and is connected with the corresponding mounting rack; voice coil motors are symmetrically arranged on the two sides of the mounting frame, mounting bases are arranged at the output ends of the voice coil motors, and swing arms are arranged on the mounting bases; the workbench is also provided with a plurality of visual CCDs and a control solenoid valve. The plurality of visual CCDs are distributed at two sides of the pick-and-place die bond mechanism. Through the arrangement of the overall structure, the double swing arms alternately move, the time is shortened, and the productivity efficiency is greatly improved.

Description

technical field [0001] The invention relates to the field of semiconductor automatic integrated equipment, in particular to a pick-and-place structure and die-bonding equipment. Background technique [0002] With the rapid development of science and technology and the continuous new generation of semiconductor materials, the information technology industry is becoming more and more yellow, and semiconductor automatic integrated equipment is born. The equipment not only reduces labor costs, improves the utilization of resources, but also greatly improves production efficiency. The equipment can provide convenience for people in daily use, but it still has the following shortcomings: the traditional semiconductor automatic integrated equipment consists of a swing arm and a set of Z-axis mechanisms that move up and down. Removing a chip has low productivity, so we made improvements and proposed a pick-and-place structure and die-bonding equipment. SUMMARY OF THE INVENTION ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67121H01L21/67742
Inventor 黄雄刘卫
Owner 深圳市昌富祥智能科技有限公司
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