Substrate bonding apparatus and substrate bonding method

A bonding device and bonding method technology, applied in semiconductor/solid-state device components, semiconductor/solid-state device testing/measurement, semiconductor devices, etc., can solve problems such as difficult maintenance, complex installation, and reduced efficiency, and improve space utilization. rate, prevent coordinate errors, and reduce unqualified effects

Pending Publication Date: 2022-07-01
TES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In order to correct the above-mentioned errors during the reset operation, other conventional techniques have been developed that apply correction methods using a laser interferometer or a correction method using another optical meter structure. Process increases the time it takes to bond substrates, thereby reducing efficiency
[0013] In addition, the substrate bonding device in the prior art is equipped with cameras in the upper and lower parts of the cavity, which makes the device complex, reduces the space utilization rate inside the cavity, and is difficult to maintain.

Method used

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  • Substrate bonding apparatus and substrate bonding method
  • Substrate bonding apparatus and substrate bonding method
  • Substrate bonding apparatus and substrate bonding method

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Embodiment Construction

[0048] Hereinafter, the configuration of the substrate bonding apparatus 1000 according to the embodiment of the present invention will be specifically described with reference to the drawings.

[0049] figure 1 It is a side cross-sectional view of a substrate bonding apparatus 1000 according to an embodiment of the present invention.

[0050] refer to figure 1 , the substrate bonding apparatus 1000 has: a cavity 100 ; a first chuck 200 arranged inside the cavity 100 to adsorb the first substrate 40 ; a second chuck 300 to face the first chuck 200 It is arranged inside the cavity 100 and can move relative to the first chuck 200 in the vertical and horizontal directions to adsorb the second substrate 20 ; and the camera 510 is located in the first chuck 200 and the second chuck 200 . Either side of the upper and lower parts of the chuck 300 is used to identify the first sorting key 42 of the first substrate 40 and the second sorting key 22 of the second substrate 20 .

[0...

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Abstract

The present invention provides a substrate bonding apparatus and a substrate bonding method, and more particularly, to a substrate bonding apparatus and a substrate bonding method, which simplify the structure of a substrate bonding apparatus for bonding substrates and reduce errors caused by misalignment of the substrates when the substrates are bonded.

Description

technical field [0001] The present invention relates to a substrate bonding apparatus and a substrate bonding method, and more particularly, to a substrate bonding apparatus that simplifies the structure of bonding substrates, and that reduces errors caused by misalignment of substrates when bonding substrates, and Substrate bonding method. Background technique [0002] Recently, with the development of technology and industry, there has been an increasing demand for high integration of semiconductor devices or substrates (hereinafter referred to as "substrates"). In this case, when a highly integrated substrate is arranged in a horizontal plane and is commercialized by wiring connection, problems such as increase in wiring length, increase in wiring impedance, and wiring delay arise. [0003] Therefore, a three-dimensional integration technique using three-dimensional stacking of substrates has been proposed. In this three-dimensional integration technique, for example, b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67H01L21/68
CPCH01L21/6838H01L21/68H01L21/67259H01L23/544H01L2223/54426H01L2223/54486H01L21/67092H01L21/681H01L21/67294H01L21/187H01L24/75H01L22/20H01L2224/8313H01L2224/75753H01L24/83
Inventor 河周一金永彬金宰焕卢东珉沈愚泌
Owner TES CO LTD
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