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Wafer detection device

A detection device and wafer technology, applied in the direction of optical defect/defect, sorting, workshop equipment, etc., can solve the problems of low efficiency and easy missed inspection, and achieve the effect of improving production efficiency and facilitating detection

Pending Publication Date: 2022-07-15
无锡光诺自动化科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the detection of wafer scratches or stains generally uses manual identification, which is inefficient and easy to miss

Method used

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  • Wafer detection device
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Embodiment Construction

[0025] The specific embodiments of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0026] Unless expressly stated otherwise, throughout the specification and claims, the term "comprising" or its conjugations such as "comprising" or "comprising" and the like will be understood to include the stated elements or components, and Other elements or other components are not excluded.

[0027] like Figure 1 to Figure 3As shown in the figure, a wafer inspection device is provided with a base 1, a detection position slide rail 1 34, a detection position pick-and-place slide rail 33, a direction detection frame 6 and a spotting frame 23 on the base 1, respectively. One 34 is fixedly set with the detection position moving cylinder 1 4, between the detection position slide rail 1 34 and the detection position picking and discharging slide rail 33, a placing se...

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PUM

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Abstract

The invention relates to a wafer detection device, which comprises a base, and a detection position slide rail I, a detection position material taking and placing slide rail, a direction detection frame and a dotting frame which are respectively arranged on the base, a first detection position moving air cylinder is fixedly arranged on the first detection position sliding rail. A placing seat I is arranged between the detection position slide rail I and the detection position material taking and placing slide rail in a sliding manner; the detection position moving cylinder I is connected with the placement seat I; a material placing device I is arranged on the placing seat I and is used for placing a wafer and rotatably positioning the wafer; a first material taking and placing device is arranged on one side of the detection position material taking and placing sliding rail and used for taking the wafers from the wafer box and placing the wafers into the first placing device or taking the wafers from the first placing device and placing the wafers into the wafer box. A direction detection camera I is arranged on one side of the direction detection frame; a defect detection camera is arranged on the other side of the direction detection frame; a dotting machine is arranged on the dotting frame. The wafer defect detection device has the advantages that wafer defects can be conveniently detected and dotted and marked, and the production efficiency is improved.

Description

Technical field: [0001] The present invention relates to the field of chip technology, in particular to a wafer inspection device. Background technique: [0002] During the manufacturing process of wafers, scratches often occur on the surface, and there will be surface stains during the production process. Such wafers with surface scratches or surface stains will be scratched or stained when they are subsequently sliced ​​into chips. The quality of the chip is generally poor. In order to avoid this bad phenomenon, the wafer should be inspected before slicing, and the defective wafer should be removed, or the defective part of the wafer should be marked. When slicing, the marked wafer should be removed. , to avoid poor quality of sliced ​​chips. At present, the detection of wafer scratches or stains generally adopts manual identification, which is inefficient and easy to miss. [0003] The information disclosed in this Background section is only for enhancement of understan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/34B07C5/02B07C5/36B07C5/38G01N21/95H01L21/67B25H7/04
CPCB07C5/34B07C5/02B07C5/361B07C5/362B07C5/38G01N21/9501H01L21/67034H01L21/67271B25H7/04
Inventor 韩志刚
Owner 无锡光诺自动化科技有限公司