Method and system for controlling air pressure of semiconductor exposure equipment
A control method and semiconductor technology, which is applied in the direction of microlithography exposure equipment, photolithography exposure device, etc., can solve the problems affecting the cleanliness of the exposure area and the degradation of wafer exposure quality, and achieve the effect of ensuring the cleanliness
Pending Publication Date: 2022-07-15
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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Frictional particles can also affect the cleanliness of the exposure area during the exposure process, resulting in a decrease in the exposure quality of the wafer
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[0028] In order to make the purposes, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only It is a part of the embodiments of the present application, but not all of the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations. Thus, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application as claimed, but is merely representative of selected embodiments of the application. Based on the embodiments of the present application, every other em...
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The invention provides a control method and system for air pressure of semiconductor exposure equipment, the semiconductor exposure equipment comprises an exposure area and a transmission area, and the method comprises the following steps: acquiring air pressure values of the exposure area and the transmission area; judging whether the air pressure value of the exposure area is smaller than or equal to that of the transmission area; if the air pressure value of the exposure area is smaller than or equal to the air pressure value of the transmission area, calculating a first air pressure difference value between the exposure area and the transmission area; according to the first air pressure difference value, the air inlet volume and / or the air outlet volume of the exposure area are / is controlled, so that the air pressure value of the exposure area is larger than the air pressure value of the transmission area. The air pressure values of the exposure area and the transmission area of the semiconductor exposure equipment are controlled, so that the air pressure value of the exposure area is greater than the air pressure value of the transmission area, and the effect of ensuring the cleanliness of the exposure area is achieved.
Description
technical field [0001] The present application relates to the technical field of semiconductor manufacturing, and in particular, to a method and system for controlling air pressure of semiconductor exposure equipment. Background technique [0002] In the process of exposing the wafer, the cleanliness of the exposure area is very high. At present, in the semiconductor exposure equipment, the exposure area often enters through the interface during the transportation of the reticle and the wafer due to external impurities. Into the exposure area, the cleanliness of the exposure area cannot meet the requirements, which in turn leads to a decrease in the exposure quality of the wafer. [0003] Moreover, in semiconductor exposure equipment, during the handover process of the wafer or reticle, there will be relative motion with the contacting parts. During the movement, the wafer or reticle and the contacting parts will rub against each other, and friction particles will be formed....
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IPC IPC(8): G03F7/20
CPCG03F7/70916
Inventor 董晴晴崔岳张帅卢志辉刘一鸣
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC