Rotay polishing quasi-molecular laser fine processing method and system thereof

Abstract

An excimer laser technology for precisely machining the axially-symmetrical miniature part includes such steps as fixing a workpiece to a movable bench via axle regulator and rotary bench, coinciding the rotary axis of workpiece with that of rotary bench, starting excimer laser device to make the laser beams be focused the tangent point of the position to be machined, and rotating the rotary bench while moving the movable bench by computer to each the excess material on workpiece. Its advantages are high surface finish quality and high precision.

Description

technical field [0001] The method and system of rotary polishing type excimer laser micromachining belong to the technical field of laser processing, and mainly relate to the processing of miniature axisymmetric components. Background technique [0002] In the previous excimer microfabrication methods, one is to project the laser beam directly onto the workpiece to obtain the required microstructure through the mask imaging, and the other is to use the laser beam to focus and write directly on the workpiece to etch. Although these two working methods can obtain the required three-dimensional microstructure by cooperating with the workbench, the processing steps are relatively complicated, and the processing accuracy is easily limited by factors such as masks and focused light spots, and neither of them can realize the three-dimensional microstructure of the workpiece. Surface quality optimization. [0003] Traditional mechanical grinding methods such as cylindrical grinder ...

AI Technical Summary

Problems solved by technology

Although these two working methods can obtain the required three-dimensional microstructure by cooperating with the workbench, the processing steps are relatively complicated, and the processing accuracy is easily limited by factors such as masks and focused light spots, and neither of them can realize the three-dimensional microstructure of the workpiece. surface quality optimization

[0003] Traditional mechanical grinding methods such as cylindrical grinder grinding, rotary plane polishing machine polishing, ultrasonic grinding, etc., although they can polish the surface of macroscopic mechanical parts well, but when it comes to the field of tiny devices, they rely on mechanical contact The grinding method will not only fail to meet the processing requirements but also seriously damage the workpiece, causing it to deform or even break

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