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Novel ceramic package of bolometer

A technology of bolometer and ceramic packaging, which is applied in the field of bolometer, can solve the problems of bolometer packaging and welding wire difficulties, and achieve the effect of cost reduction, easy realization and cost reduction

Pending Publication Date: 2021-05-14
深圳市联科威科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a new type of ceramic packaging for the bolometer, which solves the difficult problems of the traditional bolometer packaging and welding wires

Method used

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  • Novel ceramic package of bolometer
  • Novel ceramic package of bolometer
  • Novel ceramic package of bolometer

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Effect test

Embodiment 1

[0037] Such as Figure 1-4 As shown, the embodiment of the present invention provides a novel ceramic package for the bolometer, including a wafer, the sensor unit is installed in the wafer or the sensor unit is installed above the wafer, and the wafer is arranged symmetrically at the position where the sensor unit is installed There is a pad, and the pad position is glued and connected with solder balls. After that, the wafer is sawed into small pieces, and the small piece is the bolometer. The bonded solder balls on the bolometer are then bonded and bonded to the ceramic pad, followed by vacuum packaging and lens covering.

Embodiment 2

[0039] Such as Figure 5-6 As shown, in addition to the basic packaging method described above, some other changes have been made on the basic method. The first change is to add a reflective layer inside the ceramic and between the sensing elements of the bolometer, and the reflective layer and the ceramic Adhesive connection.

Embodiment 3

[0041] Such as Figure 7-8 As shown, in addition to the basic packaging method described above, some other changes have been made on the basic method. The second change is to bond an interposer on the bolometer-bonded solder balls, and to The other end of the layer is adhesively connected to a pad in the ceramic package.

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Abstract

The invention provides a novel ceramic package of a bolometer, and relates to the technical field of bolometers. The novel ceramic package based on the bolometer comprises a wafer, a sensor unit is installed in the wafer or the sensor unit is installed above the wafer, gaskets are symmetrically arranged at the positions, where the sensor unit is installed, of the wafer, solder balls are bonded and connected to the positions of the gaskets, then the wafer is sawed into small pieces, the small piece is a bolometer, the small piece is placed in ceramic to be packaged, ceramic pads are symmetrically arranged in the ceramic, solder balls bonded on the bolometer are bonded and connected to the ceramic pads, and then vacuum packaging and lens covering are carried out. According to the invention, the wafer level collision in the bolometer sensor is combined, so that the bolometer sensor can be subjected to micro ceramic vacuum packaging, the sensor is protected from the bottom by the suspension area, and meanwhile, the assembly efficiency is improved and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of bolometers, in particular to a novel ceramic package for bolometers. Background technique [0002] In recent years, the demand for infrared imager and detector sensors has grown rapidly, and typical applications include motion detection, temperature sensing, and presence detection. These products are developed into different applications in health management systems, security systems, industrial applications, consumer electronics, automotive electronics, etc. Bolometer sensors are widely used in advanced fields. However, existing fabrication techniques for bolometer sensors still have room for improvement in terms of fabrication efficiency and production cost. [0003] Traditional bolometer infrared sensor packaging is to die-cast the bolometer sensor on a ceramic base and then wire solder to connect the pad on the sensor to the pad on the ceramic base. This method is only suitable for the packaging of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0203H01L31/101G01J5/20G01J5/02
CPCH01L31/0203H01L31/101G01J5/20G01J5/02
Inventor 黄树红
Owner 深圳市联科威科技有限公司
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