Retreating method for saving integrated circuit assembly

A technology of integrated circuits and components, applied in the field of rework and rescue of integrated circuit components, can solve the problems of time-consuming, consumption, waste of materials and time
CN1233035CInactive Publication Date: 2005-12-21VIA TECH INC

Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Patents(China)
Current Assignee / Owner
VIA TECH INC
Publication Date
2005-12-21
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention relates to a working method for reworking and rescuing an integrated circuit assembly. The integrated circuit assembly is packaged in a Ball Grid Array (BGA) manner, which includes: (a) firstly using a The initial inspection step is to screen out damaged and failed integrated circuit components, (b) bake the target integrated circuit components at a predetermined temperature for a predetermined time, (c) remove at least one solder ball of the integrated circuit components , and (d) re-soldering the solder-removed portions of the integrated circuit assembly.
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Description

technical field

[0001] The invention relates to a method for reworking and rescuing integrated circuit components, in particular to a method for selecting whether to re-solder soldered integrated circuit components packaged in a ball grid array, so as to save the integrated circuit components for the next step of testing. Methods of operation of circuit assemblies. Background technique

[0002] Generally speaking, when the customer finds substandard integrated circuit components, they will return these integrated circuit components to the manufacturer, hoping to conduct quality analysis or replace them. At this time, the manufacturer will try to determine whether these returned IC components are really unqualified IC components as the customer said, and if they are really unqualified IC components, they can understand which pins are faulty and why. The unqualified analysis will help IC component manufacturers to refer to the next batch of IC components to avoid the occurren...

Claims

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