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Retreating method for saving integrated circuit assembly

A technology of integrated circuits and components, applied in the field of rework and rescue of integrated circuit components, can solve the problems of time-consuming, consumption, waste of materials and time

Inactive Publication Date: 2005-12-21
VIA TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the instantaneous high temperature (for example, about 180 to 260 degrees Celsius) that comes with re-soldering will cause the moisture inside the integrated circuit component to expand rapidly due to thermal shock, causing bursting or delamination, etc. Popcorn failure will make it difficult to obtain correct results for the unqualified analysis that will be carried out later, and also waste the materials and time required for re-soldering
[0005] In addition, the entire process from re-soldering to checking whether the re-soldering is complete, to cleaning the entire integrated circuit assembly will take five to six minutes
When the number of IC components that need to be re-soldered for IC component pin function testing is large, it will still take a considerable amount of time overall

Method used

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  • Retreating method for saving integrated circuit assembly
  • Retreating method for saving integrated circuit assembly
  • Retreating method for saving integrated circuit assembly

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Embodiment Construction

[0012] see figure 1 , figure 1 It is a flow chart of the working method 100 of the first preferred embodiment of the present invention. Working method 100 of the present invention comprises the following steps:

[0013] Step 101: start;

[0014] Step 102: remove the unqualified integrated circuit assembly from the main board, which is the target integrated circuit assembly to be inspected;

[0015] Step 103: Execute the initial inspection step to inspect the target integrated circuit component, if it is unqualified, go to step 104, if it is qualified, go to step 105;

[0016] Step 104, the integrated circuit component is judged as defective and discarded;

[0017] Step 105: Bake the target IC device at a predetermined temperature for a predetermined time;

[0018] Step 106: removing solder;

[0019] Step 107: cleaning the integrated circuit assembly;

[0020] Step 108: re-soldering the integrated circuit component with solder;

[0021] Step 109: Execute the re-inspecti...

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Abstract

The invention relates to a working method for reworking and rescuing an integrated circuit assembly. The integrated circuit assembly is packaged in a Ball Grid Array (BGA) manner, which includes: (a) firstly using a The initial inspection step is to screen out damaged and failed integrated circuit components, (b) bake the target integrated circuit components at a predetermined temperature for a predetermined time, (c) remove at least one solder ball of the integrated circuit components , and (d) re-soldering the solder-removed portions of the integrated circuit assembly.

Description

technical field [0001] The invention relates to a method for reworking and rescuing integrated circuit components, in particular to a method for selecting whether to re-solder soldered integrated circuit components packaged in a ball grid array, so as to save the integrated circuit components for the next step of testing. Methods of operation of circuit assemblies. Background technique [0002] Generally speaking, when the customer finds substandard integrated circuit components, they will return these integrated circuit components to the manufacturer, hoping to conduct quality analysis or replace them. At this time, the manufacturer will try to determine whether these returned IC components are really unqualified IC components as the customer said, and if they are really unqualified IC components, they can understand which pins are faulty and why. The unqualified analysis will help IC component manufacturers to refer to the next batch of IC components to avoid the occurren...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28H01L21/50H01L21/66H01L21/98
Inventor 王振芳黄耀奎
Owner VIA TECH INC
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