Unlock instant, AI-driven research and patent intelligence for your innovation.

Microjet array cooling heat sink

A micro-jet and array technology, applied in the field of microelectronics, can solve problems such as low fluid temperature, high fluid temperature at the outlet, and poor cooling effect

Inactive Publication Date: 2005-12-21
BEIJING UNIV OF TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The result is that the fluid temperature at the inlet of the channel is low and the cooling effect is good, while the fluid temperature at the outlet is high and the cooling effect is relatively poor, resulting in uneven temperature distribution of the heat transfer surface

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microjet array cooling heat sink
  • Microjet array cooling heat sink
  • Microjet array cooling heat sink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Such as image 3 As shown, the semiconductor laser bar 16 is cooled by a micro-fluidic array heat sink, and the length, width and thickness of a typical semiconductor laser bar 16 are 10000×1000×115 microns 3 , wherein there are several uniformly arranged laser emitters, and the microfluidic array heat sink 15 consists of figure 1 The flow-passing sheet 1, the injection-inflow sheet 2, the jet-nozzle sheet 3, the jet-outlet sheet 4, and the heat transfer sheet 5 are welded in sequence, each sheet is rectangular, and the width is the same as the length of the semiconductor laser bar 16. Semiconductor laser bar 16 is fixed on the heat transfer sheet 5, and the jet nozzle 11 is made up of a row of round holes with a diameter of 70 microns, and the depth of the round holes is the thickness of the jet nozzle sheet 3, which is 300 microns, and the number and position of the round holes are the same as The number and position of the laser emitters in the laser bar correspond ...

Embodiment 2

[0030] Such as Figure 4 As shown, the jet outlet mouth 14 on the jet outlet mouth piece 4 has a microchannel 17, the number and position of the microchannel 17 correspond to the circular holes in the jet nozzle 11, and the width of the microchannel 17 is 300-500 microns, After the processing of each piece is completed, they are welded together in turn to form a micro-jet cooling heat sink. The fluid flows through the heat sink in the following order: liquid inlet 6, liquid inlet hole 9, liquid inlet diversion channel 12, jet into the mouth 8, Jet nozzle 11, microchannel 17, jet exit mouth 14, liquid outlet guide channel 13, liquid outlet 10, liquid outlet 7; when the fluid enters the jet inlet 8, it first passes through the jet nozzle 11 at a higher speed , spray vertically on the heat transfer sheet 5, realizing high heat flux heat transfer, and then the fluid flows to the jet outlet cavity 14 through the microchannel 17, realizing heat exchange with the heat transfer surfac...

Embodiment 3

[0032] Such as Figure 5 As shown, two jet nozzle sheets 3 with a thickness of 200 microns are used, and the jet nozzle 11 is composed of a row of uniformly arranged width of 40 microns and a length of 500 microns. , the thickness of the flow sheet 1, the injection mouth sheet 2, and the heat transfer sheet 5 are all 300 microns, such as Figure 6 shown as having Figure 5 Schematic of the heat sink for the structure. The flow sequence of the fluid inside the heat sink is: liquid inlet 6, liquid inlet hole 9, liquid inlet diversion channel 12, jet inlet mouth 8, jet nozzle 11, jet outlet mouth 14, liquid outlet diversion channel 13, liquid outlet Hole 10, liquid outlet 7. The fluid is sprayed vertically and at high speed on the heat transfer sheet 5 through the rectangular hole of the jet nozzle 11 in a plane jet manner, so as to realize the cooling of some devices with long and narrow heat-generating regions.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A micro-jet array cooling heat sink belongs to the technical field of microelectronics and relates to a cooling device. The present invention comprises a flow sheet (1), a jet flow sheet (2), a jet nozzle sheet (3), a jet outlet sheet (4), a heat transfer sheet (5) which are sequentially packaged together; the flow sheet (1) ) is provided with a liquid inlet and a liquid outlet; the jet into the oral cavity sheet (2) is provided with a jet into the oral cavity, a liquid inlet hole and a liquid outlet hole; The jet nozzle on the ejection-outlet tablet (4) communicates with the jet-outlet mouth, communicates with the liquid inlet hole and the liquid inlet diversion channel for jetting into the oral cavity, and communicates with the liquid outlet hole and the liquid outlet diversion channel for jetting out of the oral cavity; the jet flows out of the oral cavity The sheet (4) is provided with jets that flow out of the oral cavity. The invention realizes high heat flux heat transfer, has extremely high heat exchange rate, effectively reduces the temperature of the heat exchange surface of the electronic device, and can improve the uniformity of the temperature distribution of the heat exchange surface.

Description

technical field [0001] The invention belongs to the technical field of microelectronics and relates to a cooling device. Background technique: [0002] With the continuous development of industrial technology, all kinds of electronic products are developing in the direction of small size, light weight and high heat flux. Therefore, for the new generation of electronic equipment, the design limit and manufacturing technology of the traditional cooler can no longer meet the requirements. The development of micro-coolers stems from solving the heat dissipation problem of high-speed integrated circuits. At present, it has developed into various high heat flux fields with weight restrictions and volume restrictions, such as aerospace industry, cooling of electronic components, cooling of high-power semiconductor lasers, chemical process heat transfer etc. Its main purpose is to reduce the probability of failure and damage of electronic equipment due to overheating, and at the s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473
Inventor 夏国栋
Owner BEIJING UNIV OF TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com