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Microjet array cooling heat sink

A micro-jet and array technology, applied in the field of microelectronics, can solve the problems of poor cooling effect, good cooling effect, and low fluid temperature

Inactive Publication Date: 2004-01-28
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The result is that the fluid temperature at the inlet of the channel is low and the cooling effect is good, while the fluid temperature at the outlet is high and the cooling effect is relatively poor, resulting in uneven temperature distribution of the heat transfer surface

Method used

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  • Microjet array cooling heat sink
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Such as image 3 As shown, the semiconductor laser bar 16 is cooled by a micro-fluidic array heat sink, and the length, width and thickness of a typical semiconductor laser bar 16 are 10000×1000×115 microns 3 , wherein there are several uniformly arranged laser emitters, and the microfluidic array heat sink 15 consists of figure 1 The flow-passing sheet 1, the injection-inflow sheet 2, the jet-nozzle sheet 3, the jet-outlet sheet 4, and the heat transfer sheet 5 are welded in sequence, each sheet is rectangular, and the width is the same as the length of the semiconductor laser bar 16. Semiconductor laser bar 16 is fixed on the heat transfer sheet 5, and the jet nozzle 11 is made up of a row of round holes with a diameter of 70 microns, and the depth of the round holes is the thickness of the jet nozzle sheet 3, which is 300 microns, and the number and position of the round holes are the same as The number and position of the laser emitters in the laser bar correspond ...

Embodiment 2

[0031] Such as Figure 4 As shown, the jet outlet mouth 14 on the jet outlet mouth piece 4 has a microchannel 17, the number and position of the microchannel 17 correspond to the circular holes in the jet nozzle 11, and the width of the microchannel 17 is 300-500 microns, After the processing of each piece is completed, they are welded together in turn to form a micro-jet cooling heat sink. The fluid flows through the heat sink in the following order: liquid inlet 6, liquid inlet hole 9, liquid inlet diversion channel 12, jet into the mouth 8, Jet nozzle 11, microchannel 17, jet exit mouth 14, liquid outlet guide channel 13, liquid outlet 10, liquid outlet 7; when the fluid enters the jet inlet 8, it first passes through the jet nozzle 11 at a higher speed , spray vertically on the heat transfer sheet 5, realizing high heat flux heat transfer, and then the fluid flows to the jet outlet cavity 14 through the microchannel 17, realizing heat exchange with the heat transfer surfac...

Embodiment 3

[0033] Such as Figure 5 As shown, two jet nozzle sheets 3 with a thickness of 200 microns are used, and the jet nozzle 11 is composed of a row of uniformly arranged width of 40 microns and a length of 500 microns. , the thickness of the flow sheet 1, the injection mouth sheet 2, and the heat transfer sheet 5 are all 300 microns, such as Image 6 shown as having Figure 5 Schematic diagram of the heat sink of the structure. The flow sequence of the fluid inside the heat sink is: liquid inlet 6, liquid inlet hole 9, liquid inlet diversion channel 12, jet inlet mouth 8, jet nozzle 11, jet outlet mouth 14, liquid outlet diversion channel 13, liquid outlet Hole 10, liquid outlet 7. The fluid is sprayed vertically and at high speed on the heat transfer sheet 5 through the rectangular hole of the jet nozzle 11 in a plane jet manner, so as to realize the cooling of some devices with long and narrow heat-generating regions.

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PUM

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Abstract

The invention comprises the flow pass slice, jet inlet cavity slice, ejector nozzle slice, jet outlet slice and heat transfer slice. There are fluid inlet and fluid outlet in the flow pass slice, and there are jet inlet cavity, fluid inlet and outlet orifice in jet inlet cavity slice. The ejector nozzle slice comprises the ejector nozzle, the feed fluid diversion channel and the filtrate diversion channel. The ejector nozzle is connected to the jet inlet cavity and jet outlet cavity on the jet outlet slice. The feed fluid diversion channel is connected to the fluid inlet orifice and the jet inlet cavity. The filtrate diversion channel is connected to the fluid outlet orifice and the jet outlet cavity. The invention realizes heat transfer with high heat flux, possessing very high heat transfer rate so as to lower temperature on heat exchange surface of electron device effectively as well as raise evenness of temperature distribution.

Description

technical field [0001] The invention belongs to the technical field of microelectronics and relates to a cooling device. Background technique: [0002] With the continuous development of industrial technology, all kinds of electronic products are developing in the direction of small size, light weight and high heat flux. Therefore, for the new generation of electronic equipment, the design limit and manufacturing technology of the traditional cooler can no longer meet the requirements. The development of micro-coolers stems from solving the heat dissipation problem of high-speed integrated circuits. At present, it has developed into various high heat flux fields with weight restrictions and volume restrictions, such as aerospace industry, cooling of electronic components, cooling of high-power semiconductor lasers, chemical process heat transfer etc. Its main purpose is to reduce the probability of failure and damage of electronic equipment due to overheating, and at the s...

Claims

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Application Information

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IPC IPC(8): H01L23/473
Inventor 夏国栋
Owner BEIJING UNIV OF TECH
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