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Technique for preparing high comductive wearable antifictional copper based composite material

A copper-based composite material and a preparation process technology are applied in the field of preparation technology of high-conductivity, wear-resistant and friction-reducing copper-based composite materials, and can solve the problem of poor bonding between the reinforcement and the matrix interface, high equipment condition requirements, and difficult material quality control. and other problems, to achieve the effect of low cost, good wear resistance and excellent mechanical properties

Inactive Publication Date: 2006-04-19
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because these processes are relatively complicated, the quality of materials is difficult to control, and the requirements for equipment conditions are high, the cost is high and there is still a certain distance from large-scale production.
At the same time, due to the poor wettability and large density difference between copper and most ceramics, the aggregation of reinforcements is easy to occur when prepared by conventional methods, resulting in uneven particle distribution, and the interface between the reinforcement and the matrix is ​​not well bonded.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] (1) Take 384.6g of electrolytic copper powder and 15.4g of nickel-plated SiC powder with an average particle size of 14μm, stir and dry mix, then add 0.52g of 20# engine oil, stir evenly, and then put it into a conventional powder mixing device and mix for 4 hours.

[0015] (2) Put the mixed powder into a mould, cold press it into a billet under a pressure of 130Mpa, and hold the pressure for 5 minutes.

[0016] (3) Put the above-mentioned compact into an ammonia decomposition furnace for sintering at a sintering temperature of 800° C. and a sintering time of 3 hours; furnace cooling.

[0017] (4) Heating the sintered compact to 790° C. and keeping it warm for 5 minutes; meanwhile, the extrusion mold is preheated at a temperature of 350° C. Put the preheated compact into an extrusion die and extrude with an extrusion ratio of 10:1.

[0018] The test results show that the reinforcements are evenly distributed, the density of the material is 98.6%, the Brinell hardness (...

Embodiment 2

[0020] (1) Take 384.6g of electrolytic copper powder and 15.4g of nickel-plated SiC powder with an average particle size of 20μm, stir and dry mix, then add 0.52g of 20# engine oil, stir evenly, and then put it into a conventional powder mixing device and mix for 4 hours.

[0021] (2) Put the mixed powder into a mould, cold press it into a billet under a pressure of 140Mpa, and hold the pressure for 5 minutes.

[0022] (3) Put the above-mentioned compact into an ammonia decomposition furnace for sintering, the sintering temperature is 820°C, and the sintering time is 3 hours; the furnace is cooled.

[0023] (4) Heating the sintered compact to 800° C. and keeping it warm for 5 minutes; meanwhile, the extrusion mold is preheated at a temperature of 350° C. Put the preheated compact into an extrusion die and extrude with an extrusion ratio of 10:1.

[0024] The test results show that the reinforcements are evenly distributed, the density of the material is 98.5%, the Brinell har...

Embodiment 3

[0026] (1) Take 376.2g of electrolytic copper powder, 23.8 / g of nickel-plated SiC powder with an average particle size of 14μm, stir and dry mix, then add 0.6g of 20# engine oil dispersant, stir evenly, and then put it into a conventional powder mixing device and mix for 4 hours .

[0027] (2) Put the mixed powder into a mould, cold press it into a billet under a pressure of 150Mpa, and keep the pressure for 5 minutes.

[0028] (3) Put the above-mentioned compact into an ammonia decomposition furnace for sintering, the sintering temperature is 810°C, and the sintering time is 3 hours; the furnace is cooled.

[0029] (4) Heating the sintered compact to 800° C. and keeping it warm for 5 minutes; meanwhile, the extrusion mold is preheated at a temperature of 350° C. Put the preheated compact into an extrusion die and extrude with an extrusion ratio of 10:1.

[0030] The test results show that the reinforcements are evenly distributed, the density of the material is 98.4%, the B...

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Abstract

A preparation technology for high electric conduction, abrasive resistance, antifriction copper base compound material takes electrolysis copper powder, nickel plating or SiC powders and copper plating graphite powder as the raw material to be dry mixed, humid mixed with a dispersant agent, cold pressure, sinter, hot extrusion or hot pressing to manufacture the high conduction abrasive resistance antifriction copper base compound material.

Description

technical field [0001] The invention relates to a preparation process of a metal-based composite material, in particular to a preparation process of a high-conductivity wear-resistant and anti-friction copper-based composite material. Used in the field of sliding electrical contact technology. Background technique [0002] With the rapid development of electronics, machinery, aviation, aerospace and other industries, there is an urgent need to develop functional materials with good electrical conductivity, thermal conductivity, wear resistance, excellent mechanical properties, and moderate prices, such as electronic materials, wear-resistant materials, Thermal resistance materials, brush materials and nozzle materials, etc. Copper-based composite materials can maintain the excellent electrical and thermal conductivity of copper itself, and at the same time, by adding a single or mixed reinforcement, the material can be endowed with higher mechanical properties and good trib...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00
Inventor 张国定湛永钟
Owner SHANGHAI JIAOTONG UNIV
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