Non-volatile memory preventing antenna effect and its manufacture
A non-volatile, antenna-effect technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve problems such as component programming, affecting writing speed, and reducing voltage
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no. 1 example
[0030] In order to prevent the antenna effect (Antenna Effect) caused by plasma during the production of the non-volatile memory, the present invention provides a non-volatile memory that prevents the antenna effect.
[0031] figure 1 It is a schematic top view of a non-volatile memory structure for preventing antenna effects according to the first embodiment of the present invention.
[0032] Please refer to figure 1 A word line 102 is covered on a substrate 100, and the word line 102 includes a high resistance portion 104 and a memory cell portion 106. The high-resistance portion 104 of the word line 102 is electrically connected to a ground doped region 108 in the substrate 100, and the memory cell portion 106 of the word line 102 is electrically connected to a metal interconnection line 110, and the high-resistance portion 104 is connected to the ground doped region 108 through the contact window 112; the memory cell portion 106 is connected to the metal interconnection lin...
no. 2 example
[0036] Figure 3A to Figure 3C Shown is a cross-sectional view of a manufacturing process of a non-volatile memory that prevents antenna effects according to the second embodiment of the present invention.
[0037] Please refer to Figure 3A , A substrate 300 is provided, a capture layer 302, a polysilicon layer 306, and a metal silicide layer 308 are sequentially formed on the substrate 300, and then the above-mentioned layers are patterned to form a portion having a higher resistance than other parts The high-resistance part 310 and the word line 304 of a memory cell part 312. For example, the high-resistance part 310 is narrower than other parts, so its resistance is higher than other parts of the word line 304. The capturing layer 302 is, for example, a silicon oxide / silicon nitride / silicon oxide (ONO) composite layer, and the material of the metal silicide layer 308 is, for example, tungsten silicide (WSi).
[0038] Next, please refer to Figure 3B , A ground doped region 314...
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