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Method for manufacturing micro mechanical components with different aspect ratio using X-ray exposure

A micromechanical component, x-ray technology, applied in microlithography exposure equipment, semiconductor/solid-state device manufacturing, photolithography process exposure devices, etc. The effect of small, flexible manufacturing methods

Inactive Publication Date: 2007-02-14
SHANGHAI JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, and to provide a method for manufacturing micromechanical components with different aspect ratios by X-ray exposure, so that it can be formed on the same piece of silicon only by changing the size and position of the mask pattern. A mechanical component with a variable aspect ratio in a large range can be obtained on the chip, and only one X-ray exposure is required, which can be mass-produced and overcomes the time-consuming and high-cost shortcomings of the existing technology

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  • Method for manufacturing micro mechanical components with different aspect ratio using X-ray exposure
  • Method for manufacturing micro mechanical components with different aspect ratio using X-ray exposure

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Embodiment Construction

[0010] The following embodiments are provided in conjunction with the content and accompanying drawings of the inventive method:

[0011] Such as figure 1 As shown, the total length of the x-ray beam for lithography is 1.58m, and 200μm thick beryllium (Be) and 50μm thick Kepton (kapton) windows (5mm×30mm) are used as filters to obtain photon energies exceeding 1.3kev hard x-ray.

[0012] The light intensity distribution of X-rays along the vertical direction of the mask is as follows: figure 2 shown. The size of the particle beam is 5mm (vertical) × 38mm (horizontal). In order to utilize the vertical distribution of the particle beam, the size of the mask pattern area is designed to be 5mm. During the photolithography process, the position of the mask pattern is adjusted by moving the position of the glue-spinning stage, so that the exposure energy of PMMA can be modulated.

[0013] First, a mask covered with polymer and gold absorber was fabricated. The mask image was an...

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Abstract

It is a method to process micro mechanical part with different deepness proportions by use of X ray exposal, which is used in micro process technique filed. The invention uses PMMA as etching glue and X ray exposal due to the light intensity distribution is Gauss distribution, than is to say the X ray intensity is the function of the positions and the X ray dose is controlled through Cape window size. In the same exposal time, the exposal deepness changes with positions as Gauss distribution to get the micro mechanical parts with different deepness proportions on the light etching glue.

Description

technical field [0001] The invention relates to a processing method of a micromechanical component, in particular to a method for manufacturing micromechanical components with different aspect ratios by X-ray exposure, which is used in the field of microprocessing. Background technique [0002] Micromechanical components have important implications for the trend toward device miniaturization. The mechanical properties of micromechanical components play a very critical role in the performance and reliability of microelectromechanical systems (MEMS) devices. When part of it), the mechanical components inside will be permanently damaged. Reducing the stiffness of these mechanical components will improve their reliability and performance, but at the same time the mechanical components must have sufficient modulus to efficiently transmit forces from one component to another. Therefore, there is a need to invent a method to fabricate MEMS mechanical components with a controllabl...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/00
Inventor 李以贵宋康陈水良
Owner SHANGHAI JIAOTONG UNIV