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Multiflow overcold condenser

A multi-flow, condenser technology, applied in subcoolers, evaporators/condensers, refrigerators, etc., can solve problems such as size restrictions

Inactive Publication Date: 2007-02-28
SANDEN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this traditional structure is that the condenser and the liquid tank are separated from each other, and their size is limited due to the limitation of the volume occupied by the refrigeration circuit in the vehicle
However, even in these structures, since the liquid tank presses the entire heat exchange core, it is still a space problem that needs to be solved

Method used

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  • Multiflow overcold condenser
  • Multiflow overcold condenser
  • Multiflow overcold condenser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0068]Fig. 1 shows a multi-flow type sub cool condenser (multi-flow type sub cool condenser) of the first embodiment of the present invention. Hereinafter, the multi-flow subcooled condenser is simply referred to as the condenser. The condenser 1000 mainly includes a first header 1 , a second header 2 , a plurality of flat heat transfer tubes 4 and a plurality of corrugated fins 5 . The first header 1 and the second header 2 are connected to each other through a plurality of heat transfer tubes 4 . A plurality of heat transfer tubes 4 and a plurality of corrugated fins 5 are stacked alternately. The first header 1 is divided into an upper pipe portion 1 b and a lower pipe portion 1 a by a partition plate 19 . The second header 2 is divided into an upper pipe portion 2 b and a lower pipe portion 2 a by a partition plate 8 . The inlet pipe 6 is connected to the second header 2 near the upper part of the partition plate 8 . Refrigerant flows into the upper pipe portion 2b of ...

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Abstract

A multi-flow type sub cool condenser comprises a pair of header pipes, a plurality of flat heat-transfer pipes connecting the pair of header pipes and the corrugated fins are interposed between said heat-transfer tubes. The condenser includes a refrigerant condensation chipware part and a super-cooling chipware part. The lower part of one header pipe is used as a liquid pour collecting the liquid refrigerant to transfer the liquid refrigerant to the super-cooling chipware part. There is also the desiccant in the lower part. A plug mechanism is mounted on the end part of the desiccant including header pipes, wherein the plug piece in the plug mechanism is fixed or disassembled discretionarily to replace the said desiccant.

Description

technical field [0001] The invention relates to a multi-flow subcooled condenser for a condenser in a vehicle air-conditioning device. More particularly, the invention relates to multi-flow subcooled condensers whose headers contain desiccant. Background technique [0002] Multi-flow subcooled condensers are commonly used in vehicle air conditioners. Specifically, a so-called subcooled condenser usually has a heat exchange section called a subcooling section, which further cools the liquefied refrigerant. The liquefied refrigerant must be collected somewhere before it flows into the subcooling section. The container that collects the liquefied refrigerant prior to subcooling is called a liquid tank. In Japanese Patent Laid-Open Publication Nos. 10-122705, 9-170854 and 9-170853, a liquid tank is provided near the header of the condenser. The disadvantage of this conventional structure is that the condenser and the liquid tank are separated from each other, and their size ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B39/04F25B43/00B60H1/32F25B40/02
CPCF25B40/02F25B39/04F25B2400/162F28F2220/00F25B2339/0441F25B2500/01F25B43/003
Inventor 门浩隆和田贤一上岛博光新村利治渡濑大翼冈田茂
Owner SANDEN CORP