Valveless micro-pump and packaging method thereof

A micropump and pump body technology, which is applied in the packaging field of valveless micropumps, can solve problems such as inability to realize mass production, poor reliability, and difficult sealing, and achieve the effects of stable operation, high reliability, and good sealing performance

Inactive Publication Date: 2007-08-01
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current valveless pump structure still has shortcomings such as difficult s

Method used

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  • Valveless micro-pump and packaging method thereof

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Embodiment Construction

[0011] Hereinafter, the present invention will be described in more detail with an example in conjunction with the accompanying drawings:

[0012] With reference to Figure 1, the composition of the valveless micropump includes a pump body 3 with an input port 1 and an output port 2 on the pump body. It also includes a piezoelectric ceramic buzzer 5. There is a concentric annular sealing elastic gasket 4 between the pump body and the piezoelectric ceramic buzzer. At the same time, referring to Figures 2 and 3, the shape of the annular sealing elastic gasket matches the shape of the pump cavity and the piezoelectric ceramic buzzer. , Can be round ring, rectangular ring, etc. A metal ring 6 is concentrically arranged on the piezoelectric ceramic buzzer, and a sealing adhesive resin glue 7 is arranged outside the annular sealing elastic pad, the piezoelectric ceramic buzzer and the metal ring.

[0013] The product of the present invention is packaged in such a way to make a valveless ...

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Abstract

This invention provides mini-size pump without valve and the encapsulation method. First making the body of pump, homocentric putting an annular hermetic stretch underlay in the cavity of the pump, putting piezoelectric chinaware buzzer on the underlay with its PZT side facing outside, homocentric placing a mental ring on the buzzer, using clamp to tighten the parts from top to bottom, then using hermetic resin glue to cement and solidify the parts. This invention has advantages of fine capacity of airproofing, stable functioning, high reliability, convenience of mass production and etc. This invention can be widely applied to mini-size airplanes, the thruster of mini-space probe, and the fields like micro-chemistry analysis and biological medicine.

Description

(1) Technical field [0001] The invention relates to a valveless micropump. The invention also relates to a packaging method of a valveless micropump. (2) Background technology [0002] Research work on valveless micropumps began in the early 1990s. In 1992, Richter et al. of Germany first proposed the use of valveless structures in the design of micropumps; in 1993, Sweden’s E. Stemmed et al. successfully adopted diffusion The port / nozzle structure made the micropump; in 1994, they made the first silicon-based valveless micropump based on the working principle of the valveless structure, and used anisotropic etching on (100) silicon wafers to form a pyramidal diffusion Orifice / nozzle structure; then, T.Geriach et al. made a smaller valveless micropump (7×7×1mm 3 ); In 1995 and 1996, E.Stemmed and others proposed the equivalent circuit of the lumped parameters of the valveless micropump, and began to optimize the structure design of the valveless micropump, and proposed to pass is...

Claims

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Application Information

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IPC IPC(8): F04B43/04
Inventor 刘晓为张国威田丽王喜莲
Owner HARBIN INST OF TECH
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