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Moulded piece with higher durability for short-time loaded thermal deformation

A short-term, thermal deformation technology, applied to household components, electrical components, household appliances, etc., can solve problems such as time-consuming, high cost, and expensive equipment

Inactive Publication Date: 2002-11-20
DEGUSSA AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantages of the irradiation method are obvious: expensive equipment and generally some additional logistical work, since irradiation is usually carried out outside the company and is therefore costly and time-consuming

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The following molding compounds were used in the examples:

[0028] Molding compound 1

[0029] Polyester molding compounds containing the following components:

[0030] 54% by weight polybutylene terephthalate with a viscosity number J of 107 cm 3 / g, the value is measured at 25°C in accordance with DIN 53 728 / ISO 1628 Part 5 on a solution of 0.5 g of polyester dissolved in 100 ml of phenol / o-dichlorobenzene (weight ratio 1:1).

[0031] 30% glass fiber by weight

[0032] 10% by weight brominated flame retardant

[0033] 0.5% by weight stabilizer and release agent

[0034] 5.5% by weight antimony trioxide

[0035] Molding compound 2

[0036] This polyester molding compound differs from the described molding compound 1 only in that it contains 20% by weight of polybutylene terephthalate, the remaining 34% by weight of polybutylene terephthalate being composed of a instead of a copolyester made from dimethyl terephthalate and a mixture of 1,4-butanediol and 2-buten...

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PUM

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Abstract

Molded parts made of molding compounds containing A) 35-100% by weight of thermoplastic polyester, B) 0-60% by weight of fillers or reinforcements, C) 0-20% by weight of impact Modified raw rubber, D) 0-30% by weight flame retardant, E) 0-20% by weight synergist and F) 0-5% by weight of other additives and / or processing aids, and heated at 180°C to 250°C Place the molding compound at ℃ for at least 1 hour to improve its resistance to thermal deformation under short-term load.

Description

technical field [0001] The subject of the invention is a method for the production of molded parts having a higher resistance to thermal deformation under short-term load and the molded parts produced by this method. Background technique [0002] In the electrical industry or electronics industry, certain molded parts have high shape and dimensional stability requirements under short-term high heat loads, especially under the heat loads generated by various welding methods such as reflow welding or wave welding has been improved. In this case, a temperature peak of 260 to 450° C. partially occurs in a time window of at most 30 seconds. This mainly applies to SMD devices (Surface Mounted Devices) and MIDs (Molded Connectors, ie three-dimensional circuit carriers). Glass-fibre-reinforced self-extinguishing molding compounds based on polyesters such as polybutylene terephthalate, which are mainly used for this purpose in the electrical or electronics industry, meet these requ...

Claims

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Application Information

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IPC IPC(8): C08J7/00B29C71/02C08G63/183C08G63/189C08G63/88C08K3/00C08K5/00C08K7/00C08L31/08C08L67/00C08L67/02H05K3/00
CPCB29C71/02B29K2067/00B29K2105/06B29L2031/3493C08G63/183C08G63/189C08G63/88C08L67/02C08L2666/02C08L31/08
Inventor S·施托伯H·G·罗凯姆珀R·许勒
Owner DEGUSSA AG
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