Heat-deformation-resistant semiconductive polyethylene shielding material

Abstract

The invention relates to a heat-deformation-resistant semiconductive polyethylene shielding material. The material is prepared from the following components in parts by mass: 90-105 parts of linear low density polyethylene 7042; 15-20 parts of high density polyethylene 6098; 10-15 parts of polyolefin, 15-20 parts of an ethylene-vinyl acetate copolymer; 2-5 parts of p-hydroxybenzenesulfonic acid, 10-20 parts of 5-sulfosalicylic acid, 40-50 parts of conductive carbon black, 5-10 parts of 3, 6-dibromo-1, 2-phenylenediamine, 5-10 parts of graphite, 1-3 parts of a lubricant, 1-2 parts of an organosilicon master batch GT-300, 1-2 parts of polyethylene wax, 0.5-1 part of an antioxidant 1010 and 1-3 parts of white oil 26 #. The heat-deformation-resistant semiconductive polyethylene shielding material has heat deformation resistance and low-temperature embrittlement resistance, the volume resistance change rate between 20 DEG C and 90 DEG C is reduced, the processing technology performance of the polyethylene shielding material is excellent, the extrusion surface of the polyethylene shielding material is smoother, and the cable extrusion scorching phenomenon is avoided.

Description

technical field [0001] The invention belongs to the technical field of cable shielding materials, in particular to a heat-resistant deformation semi-conductive polyethylene shielding material. Background technique [0002] Semi-conductive shielding material is an important part of medium and high voltage cables. It can make the electric field distribution inside the cable more uniform, reduce the damage caused by stress concentration to the cable insulation layer, and have a great impact on the safety and service life of the cable. For a long time, many domestic research institutions and enterprises have been committed to improving the quality level of semi-conductive shielding materials in my country and narrowing the gap with the world's advanced manufacturers. The preparation process of semi-conductive shielding materials has been continuously improved, and the formula has been continuously optimized. However, limited to raw materials, industrial base, research and devel...

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Problems solved by technology

However, with linear low-density polyethylene as the base material, the semi-conductive shielding material has poor thermal stability and thermal deformation resistance. At the same time, linear low-density polyethylene itself has relatively strong electrical insulation. In the process of manufacturing shielding, it is necessary to add a large amount of Conductive carbon black is used to improve the conductivity of the material, but the addition of a large amount of conductive carbon black greatly reduces the physical and chemical properties and processing properties of the shielding material. After thin-wall extrusion, the surface smoothness of the shielding layer is extremely poor. If the semi-conductive shielding material itself Can not guarantee smooth surface, there are uneven pits or cracks, fractures, resulting in partial discharge or insulation breakdown

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