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Resin packaging system

A resin encapsulation and mold technology, applied in the direction of electrical components, household components, household appliances, etc., can solve the problem of not easy to remove and insert the middle layer mold, etc.

Inactive Publication Date: 2002-12-25
ASAHI ENG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the middle mold is not provided with a mechanism that allows the transfer mechanism to be easily grasped, the transfer mechanism is not easily removed from and inserted into the middle mold between the upper and lower molds

Method used

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  • Resin packaging system
  • Resin packaging system
  • Resin packaging system

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Embodiment Construction

[0034] Referring to the drawings, two embodiments of the resin encapsulation system according to the present invention are described.

[0035] A resin encapsulation system according to a first embodiment of the present invention includes a molding machine using an upper mold, a middle mold, and a lower mold.

[0036] 4A, the upper mold 102 and the lower mold 103 are fixed on the molding machine 104, while the middle mold 101 remains free without being fixed on the upper mold 102 or the lower mold 103. Reference numeral 109 in FIG. 4A indicates a gate portion.

[0037] FIG. 4B shows a perspective view of the middle mold 101 . Referring to FIG. 4B, the middle layer mold 101 is provided with a cavity 105 forming a resin encapsulation part, a gate 106 for injecting resin, and a passing hole (passing hole) 107 for agglomerated epoxy resin (hereinafter referred to as "aggregate") . The upper mold 102 serves as a cover plate covering the cavity portion 105 of the middle mold 101 ....

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Abstract

In a resin encapsulation system one or more middle molds remain free without mechanical connection to the upper and lower molds. Using the middle mold conveying mechanism, the middle mold circulates in the molding press, the middle mold preheating unit, the middle mold cleaning unit, and the ejection pressing unit suitable for separating the encapsulation, the sprue, and the sprue from the middle mold. The resin encapsulation molding is completed in the above cycle process.

Description

field of invention [0001] The invention relates to a resin encapsulation system for encapsulating semiconductor devices with resin, in particular to a resin encapsulation system using three-layer molds, ie an upper mold, a middle mold, and a lower mold. Background technique [0002] This resin encapsulation system is used in a process of encapsulating semiconductor chips, which are cut from wafers in several semiconductor device manufacturing steps, in molding resin. In order to manufacture semiconductor devices with high efficiency, it is necessary to improve the efficiency of the resin encapsulation molding process. [0003] Specifically, the resin encapsulation process can be divided into the following steps: the process of releasing the resin-encapsulated object from the mold, releasing the sprue and sprue from the mold, and cleaning the middle mold. To increase the efficiency of the resin encapsulation process, these steps should be performed automatically and quickly....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/26B29C45/02B29C45/14B29L31/34H01L21/00H01L21/56
CPCH01L21/565H01L21/67126H01L2924/0002H01L2924/00H01L21/56
Inventor 古田一郎梶原彰
Owner ASAHI ENG CO LTD