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Laser machining apparatus

A laser processing and laser beam technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of increased influence of Fθ lens, difficult to focus laser, and large-scale processing machine.

Inactive Publication Date: 2003-01-01
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is a problem with increasing costs
In addition, in order to double the processing speed and process two workpieces at the same time, the size of the XY stage needs to be doubled, and there is a problem of increasing the size of the processing machine.
[0022] In addition, in the device disclosed in Japanese Patent Application Laid-Open No. 11-314188, the split laser light is guided to a plurality of independent galvanometer scanner systems, and since the above-mentioned laser light is condensed by an Fθ lens, the light from the last reflection mirror in the optical path The laser beam incident on the Fθ lens is obliquely incident on the ground, so the influence of the aberration of the Fθ lens becomes large, and there is a problem that it is difficult to condense the laser light in a small size.

Method used

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  • Laser machining apparatus
  • Laser machining apparatus
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] figure 1 It is the laser processing apparatus of this embodiment. In the figure, the laser processing apparatus 1 has a laser oscillator 3, a polarizing mirror 4, a sub-deflection galvanometer scanner (first galvanometer scanner) 6, a galvanometer scanner (second galvanometer scanner) 8. Fθ lens 10, XY stage 11. Above-mentioned laser oscillator 3 is used for producing laser beam 2, and above-mentioned polarizing reflector 4 is used for the laser beam 2 that emits from laser oscillator 3 is directed to the desired direction by reflection, and above-mentioned secondary deflection galvanometer scanner 6 has pass along The sub-deflection mirror (first mirror) 5 that deflects the laser beam 2 is sequentially arranged and movable along the optical path, and the above-mentioned galvanometer scanner 8 has a deflecting laser beam 2 that is sequentially arranged and movable along the optical path. The main deflection mirror (second mirror) 7, the above-mentioned Fθ lens 10 foc...

Embodiment 2

[0068] Figure 4 It is a schematic diagram of the laser processing apparatus of Example 2 of this invention. In this example, the components with the same names as those in Example 1 are denoted by the same reference numerals.

[0069] In the figure, the laser processing device 1 has an aperture 15, a spectroscopic device 19, a phase plate 20, a galvanometer scanner 6, a polarization beam splitter 21, a main deflection galvanometer scanner 8, an Fθ lens 10, and an XY load stage 11 (not shown), the above-mentioned diaphragm 15 is used to set the linearly polarized laser beam 18 emitted from the laser oscillator 3 (not shown) to an arbitrary spot diameter on the workpiece 9, and the above-mentioned beam splitter Device 19 is used for splitting the second laser beam (hereinafter referred to as laser beam 18a) and the first laser beam (hereinafter referred to as laser beam 18b) of laser beam 18 that has passed through this aperture 15, and above-mentioned phase plate 20 makes las...

Embodiment 3

[0081] Figure 6 It is a schematic diagram of the laser processing apparatus of Example 3 of this invention. In this example, the components with the same names as those in Example 1 are denoted by the same reference numerals.

[0082] In the figure, the laser processing device 1 is composed of an aperture 15, a spectroscopic device 19, a galvanometer scanner 6a, a galvanometer scanner 6b, a main deflection galvanometer scanner 8, a Fθ lens 10, and an XY stage 11 ( not shown), the above-mentioned diaphragm 15 is used to set the laser beam 26 emitted from the laser oscillator 3 (not shown) to an arbitrary spot diameter on the workpiece 9, and the above-mentioned spectroscopic device 19 is used to The laser beam 26 of the diaphragm 15 is split into a laser beam 26a and a laser beam 26b, and the above-mentioned galvanometer scanner 6a has a mechanism for deflecting the laser beam 26b at a small angle by moving behind the galvanometer scanner along the optical path. The first se...

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PUM

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Abstract

A laser machining device according to the invention is provided with a laser oscillator for generating a laser beam, a main deflecting galvannometer mirror, an Ftheta lens, and a sub-deflecting means arranged in an optical path between the laser oscillator and the main deflecting galvanometer mirror. A means for splitting a laser beam is provided, and the sub-deflecting means is inserted into the optical path of one of the split laser beams. At the same time, both the split laser beams are incident from the same main deflecting galvannometer mirror to the Ftheta lens, and a numerical aperture in the optical system constituted by the main deflecting galvannometer mirror, the Ftheta lens, and an object is set to be not more than 0.08.

Description

technical field [0001] The invention relates to a laser processing device, in particular to a laser processing device for high-speed micro-hole processing and the like. Background technique [0002] Figure 9 It is a general laser processing device for hole processing. Among the figure, laser processing device 101 has: the laser oscillator 103 that produces laser beam 102; In order to guide the laser beam 102 emitted from laser oscillator 103 to the desired direction by reflection, the polarizing reflector 104 that is provided with; Galvanometer scanners 106a, 106b of galvanometer mirrors (mirrors whose small angle changes can greatly change the direction of the light beam) 105a, 105b as movable mirrors arranged sequentially along the optical path; will be scanned by the galvanometer 106a, 106b control the laser beam 102 in the traveling direction to focus on the Fθ lens 108 on the workpiece 107; the XY stage 109 fixes the workpiece 107 on it and drives it on the XY plane. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/064B23K26/067B23K26/082
CPCB23K26/0807B23K26/08B23K26/4025B23K26/0643B23K26/0608B23K26/0648B23K26/381B23K26/067B23K26/082B23K26/382B23K2103/50B23K26/02B23K26/06B23K26/064
Inventor 阪本雅彦竹野祥瑞祝靖彦鉾馆俊之黑泽满树
Owner MITSUBISHI ELECTRIC CORP