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Storage device array magnetic bit with of with sharing one common line

An array and device technology, applied in the field of resistive memory cell arrays, can solve problems such as error leakage current, blockage, etc.

Inactive Publication Date: 2003-10-01
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This action isolates the bit line currents from each other, effectively blocking most of the leakage current that would otherwise flow through the secondary channel, potentially causing errors in the sense function of the selected memory cell.
[0008] Several problems associated with all memory arrays are the need to simplify the structure, the desire to increase memory storage density, and the need to reduce the number of wires within the array

Method used

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  • Storage device array magnetic bit with of with sharing one common line
  • Storage device array magnetic bit with of with sharing one common line
  • Storage device array magnetic bit with of with sharing one common line

Examples

Experimental program
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Embodiment Construction

[0026] Figure 4 An MRAM memory cell array 100 comprising a common word line plane with a back-to-back diode memory cell configuration in accordance with the present invention is illustrated; a three-dimensional perspective view illustrating how multiple memory cells can be arranged to increase cell density while reducing There is a required number of wires in the technology. Memory array 100 includes a plurality of row conductors 102a-m, each serving as a common conductor for memory cells 108a and 108b. Unidirectional wires 110a and 110b are coupled to memory cells 108a and 108b, respectively. Unidirectional switches 110a and 110b allow the common wire to be moved in such a way that only one bit in the bit pair is read, sensed, or written according to the read, sense, and write process described below, while Do not allow other units to interfere with the process.

[0027] The memory array 100 further includes a first column conductor 104 and a second column conductor 106 . ...

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Abstract

A data storage device (10) having parallel memory planes is disclosed. Each memory plane comprises a first resistive cross-point plane (108a) of a memory cell, a second resistive cross-point plane (108b) of a memory cell, a plurality of conductive strips shared between the first and second planes of memory cells A word line (102), a plurality of bit lines (104), wherein each bit line connects one or more cells from a first plane to another memory cell in a second plane, and a plurality of unidirectional cells (110 ). In addition, a unidirectional cell connects a first memory cell from the first plane to a selected word line and a selected bit line along a first conductive direction, and a second unidirectional cell connects a second memory cell from the first plane to a selected bit line along a second conductive direction. A second cell of the two planes to a selected word line and a selected bit line. The device further provides a unidirectional conductive path from a memory cell in the first plane to a memory cell in the second plane sharing the same bit line.

Description

technical field [0001] The present invention relates to the field of resistive memory cell arrays. More particularly, this invention relates to a memory array having pairs of memory bits sharing a common conductor for increased array density. Background technique [0002] A resistive random access memory (RAM) is a cross-point type memory array of spaced memory cells sandwiched between two grids of wires running in an orthogonal direction above or below the cell a flat matrix. The resistive RAM array 10 shown in FIG. 1 is an example. Row conductors 12 running in one direction are called word lines, and column conductors 14 running in a second direction, generally perpendicular to the first direction, are called bit lines. The memory cells 16 are typically arranged in a square or rectangular array such that each memory cell 16 is connected to a word line 12 and an intersecting bit line 14 . [0003] In a resistive RAM array, the resistance of each memory cell has more tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/15G11C11/16H01L21/8246H01L27/10H01L27/105H01L43/08
CPCG11C11/1659G11C11/1657G11C11/1673H10B61/10G11C11/15G11C11/16
Inventor L·T·特兰
Owner SAMSUNG ELECTRONICS CO LTD