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Cleaning device and sponge roller used in semi-conductor manufacturing process

A sponge and roller technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of poor cleaning ability of sponge rollers, affecting cleaning effect, and reducing contact pressure at intermediate contact parts.

Inactive Publication Date: 2004-05-05
NAN YA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, when the sponge roller is cleaning, although the contact pressure between the sponge 210 and the wafer 230 is consistent at each contact point, the tangential velocity at each point of the wafer 230 rotation is not the same, because the tangential velocity on the surface of the wafer 230 is Rotation speed × radius of rotation, so the tangential velocity is highest at the edge of the wafer 230, and the tangential velocity approaches zero at the center of the wafer 230, so the cleaning ability of the conventional sponge roller is poor at the center
In addition, if image 3 As shown, after the conventional sponge roller is used for a period of time, its sponge 210 will be deformed due to extrusion, thereby forming a sponge surface with a concave center, causing the contact pressure at the middle contact part to decrease during cleaning, and may even be in the center of the sponge 210. The part cannot be in contact with the wafer 230, which seriously affects the cleaning effect

Method used

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  • Cleaning device and sponge roller used in semi-conductor manufacturing process
  • Cleaning device and sponge roller used in semi-conductor manufacturing process
  • Cleaning device and sponge roller used in semi-conductor manufacturing process

Examples

Experimental program
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Effect test

Embodiment 1

[0019] The first embodiment of the present invention is Figure 4 What is shown is to increase the radius of the sponge roller axis 420 at the central part, thereby directly increasing the contact pressure between the sponge roller and the wafer 430 at the central part. And because the deformation of the sponge 410 is limited, even if it deforms after a long time of use, its cleaning effect on the center of the wafer 430 is still greatly improved compared with the cleaning effect of a conventional sponge roller.

Embodiment 2

[0021] The second embodiment of the present invention is as Figure 5 What is shown is to install an inflatable cavity 540 on the sponge roller axis 520 , and adjust the shape of the sponge 510 and the contact pressure between the sponge 510 and the wafer 530 by inflating the inflatable cavity 540 . Through this device, in addition to improving the shortcomings of the conventional technology and improving the cleaning effect, different contact pressures can be applied to the wafer 530 according to the needs of the multi-channel manufacturing process. Adjust the amount of deformation compensation to prolong the service life of the sponge roller.

[0022] And because the sponge roller cleans in a rotating manner, therefore, in order to introduce the gas into the inflatable cavity 540 smoothly, a rotary joint 522 can be set between the axis 520 of the sponge roller and the motor, so as to avoid pipelines being damaged by the sponge roller. Rotating motion and knotting can't be u...

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PUM

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Abstract

Sponge roller includes axis of the roller, sponge wrapped on the axis. Contact pressure between the sponge and wafer can be adjusted by increasing radius at center part of the axis of the roller, or filling up working fluid to the cavity between the axis and the sponge. The said method also can compensate deformed depression created after long-term use. The washing unit includes roller, power supply and a rotating joint, which connects the power supply to the roller in order to prevent transporting fluid tubes from tying caused by rotating movement of sponge roller.

Description

technical field [0001] The present invention relates to a sponge roller, in particular to a sponge roller comprising: a sponge roller axis and a sponge wrapped on the sponge roller axis; further relates to a cleaning device for a semiconductor manufacturing process using the sponge roller. Background technique [0002] The present invention relates to an improved sponge roller. Generally, after the chemical mechanical polishing (CMP) process, there will be particles remaining on the surface of the wafer. These particles will affect the quality and yield of the wafer. Therefore, the polished wafer must be cleaned with a sponge roller. like figure 1 As shown in the top view of the sponge roller cleaning device, the wafer 110 is driven by the ball 130 to rotate, and the sponge roller 120 is rotated by the motor 122 to clean the surface of the wafer. However, due to the poor cleaning ability of the currently used sponge rollers, which are easily damaged and must be replaced, t...

Claims

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Application Information

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IPC IPC(8): H01L21/302
Inventor 王俊博林仲民王善樟陈志焜
Owner NAN YA TECH