Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor memory device

A storage device and semiconductor technology, applied in the fields of semiconductor devices, information storage, semiconductor/solid-state device manufacturing, etc., can solve the problems of inability to respond, inability to access the port unit at the same time, etc.

Inactive Publication Date: 2004-06-23
RENESAS TECH CORP
View PDF1 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the semiconductor memory device of the above-mentioned Patent Document 1, since the 3-port cell unit and the 1-port cell unit share the bit line, both port cell units cannot be accessed at the same time, and there is a problem that the above-mentioned request cannot be met.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor memory device
  • Semiconductor memory device
  • Semiconductor memory device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] (whole structure)

[0048] figure 1 It is a block diagram showing the structure of the semiconductor memory device according to Embodiment 1 of the present invention.

[0049] As shown in the figure, a 1-port memory cell array 11 (first memory cell array) and a 2-port memory cell array 12 (second memory cell array) are mixed and arranged on a single chip to constitute a memory macro. That is, the first port word line WL1 (first word line (common word line)) is provided in the 1-port memory cell array 11, and the first port word line WL1 (second word line (common word line)) is provided in the 2-port memory cell array 12. common word line)) and the second port word line WL2 (third word line).

[0050] The control circuit 31 receives the address input bus signal AD1, and supplies the row address to the row decoder 16 (the first row decoder) under the timing control of the read control input signal RE1 and the write control input signal WE1, and supplies the row address ...

Embodiment 2

[0145] Figure 8 is a block diagram showing the structure of a semiconductor memory device according to Embodiment 2 of the present invention. In the semiconductor storage device of Embodiment 2, a single-chip semiconductor storage device is realized by using a memory macro 60 (first memory cell array) with a 1-port memory cell structure and a memory macro 70 (second memory cell array) with a 2-port memory cell structure. .

[0146] As shown in the figure, it is realized by a combination of independently provided memory macros 60 and 70 . The memory macro 60 is composed of a 1-port memory cell array 61 , a row decoder 62 , a control circuit 63 and a column selector 64 . The first port word line WL1 (first word line) is provided in the 1-port memory cell array 61, and the first port word line WL21 (second word line) and the second port word line are provided in the two-port memory cell array 71. WL22 (3rd word line).

[0147] The control circuit 63 receives the addre...

Embodiment 3

[0164] Figure 9 is a block diagram showing the structure of a semiconductor memory device according to Embodiment 3 of the present invention.

[0165] As shown in the figure, a 1-port memory cell array 11L (first memory cell array) and a 2-port memory cell array 12R (second memory cell array) are mixedly arranged on a single chip, and a row decoder 18 (first row decoder) are sandwiched in between to form a memory macro. The first port word line WL1L (first word line) is provided in the 1-port memory cell array 11L, and the first port word line WL1R (second word line) and the second port word line are provided in the two-port memory cell array 12R. WL2 (3rd word line).

[0166] The row decoder 18 drives the word lines WL1L and WL1R for the first port to bring the same row into a common active state. Other composition and figure 1 Example 1 shown is the same.

[0167] In this way, in Embodiment 3, the control of the active state of the word lines WL1L and WL1R fo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

It is an object to obtain a semiconductor storage having a 1-chip structure which can be simultaneously accessed to memory cells present in different memory cell arrays. A 1-port memory cell array (11) provided with a word line (WL1) for a first port in common and a 2-port memory cell array (12) are provided together over one chip, thereby constituting a semiconductor storage. By selectively bringing any of a plurality of the word lines (WL1) for the first port into an active state by a row decoder (16), it is possible to simultaneously access respective memory cells of the 1-port memory cell array (11) and the 2-port memory cell array (12). By selectively bringing any of a plurality of word lines (WL2) for a second port into an active state by a row decoder (18), it is possible to singly access the 2-port memory cell array (12).

Description

technical field [0001] The present invention relates to a semiconductor memory device, and more particularly, to a combination of a plurality of memory cell structures of a MOS static RAM. Background technique [0002] Conventionally, there is a semiconductor memory device disclosed in Patent Document 1 as a semiconductor memory device composed of various types of memory cells with different port structures and the like. This semiconductor memory device is realized by providing a 3-port cell section which is simultaneously accessible to 3 ports and a 1-port cell section having one access port, and connecting them in common to at least one pair of bit lines. [0003] [Patent Document 1] [0004] Japanese Patent Laid-Open Publication No. 6-349275 [0005] [Problem solved by the invention] [0006] On the other hand, in the computer field and the like, it is required to divide data accessed in units of bit length into units of bits, and to access each data in units of divide...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/41G11C8/08G11C8/10G11C11/413G11C15/04H01L21/8244H01L27/11
CPCG11C8/10G11C11/413G11C15/04G11C7/14G11C8/14G11C11/418
Inventor 新居浩二
Owner RENESAS TECH CORP