High polymer plate and conductive plate conuecting body and part using the connecting plate
A technology of conductive plates and polymers, applied in printed circuit parts, electrical components, and the manufacture of printed circuit precursors, etc.
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Embodiment 1
[0033] A 50 μm thick polyimide film was used as the polymer plate 28 , and a 35 μm thick copper foil was used as the conductive plate 26 . Polyimide film and copper foil are placed on the production device of polymer plate and conductive plate connector, and the polyimide film unclamped from the unwinding reel 62 and the copper foil unclamped from the unwinding reel 64 are Water-cooled electrode cylinders 72 , 78 are respectively wound around and sputter-etching activation treatments are carried out in activation treatment devices 70 , 80 , respectively. . Then, the activated polyimide film and copper foil are stacked with a pressure bonding device 60 so that the activated surfaces are adjacent to each other, followed by cold pressure bonding at a compression ratio of 0.5% and wound onto a winding reel 66. , thereby producing the connecting body 20 of the polymer plate and the conductive plate.
Embodiment 2
[0035] A 50 μm thick liquid crystal polymer film was used as the polymer plate 28 , and a 35 μm thick copper foil (JIS H 3100 alloy number: C1020, oxygen-free high-conductivity copper) was used as the conductive plate 26 . The liquid crystal polymer film and the copper foil are placed on the production device of the polymer plate and the conductive plate connector, and the liquid crystal polymer film unclamped from the unwinding reel 62 and the copper foil unclamped from the unwinding reel 64 are respectively placed on the Water-cooled electrode rolls 72, 78 are wound around the vacuum chamber 52, and sputter etch activation treatments are performed in activation treatment units 70, 80, respectively. Then, the activated liquid crystal polymer film and copper foil are stacked with a pressure bonding device 60 so that the activated surfaces are adjacent to each other, followed by cold pressure bonding at a compression ratio of 3% and wound onto a winding reel 66, Thus, the conne...
Embodiment 3
[0037] A 20 μm thick polyester film was used as the polymer plate 28 , and a 35 μm thick copper foil (JISH 3100 alloy number: C1020, oxygen-free high-conductivity copper) was used as the conductive plate 26 . Polyester film and copper foil are placed on the production device of polymer plate and conductive plate connector, and the liquid crystal polymer film unclamped from the unwinding reel 62 and the copper foil unclamped from the unwinding reel 64 are vacuumed respectively. Water-cooled electrode rolls 72, 78 are wound in chamber 52 and sputter etch activation treatments are performed in activation treatment units 70, 80, respectively. Then, the activated polyester film and copper foil are stacked with the activated surfaces adjacent to each other using a pressure bonding device 60, followed by cold pressure bonding at a compression ratio of 1% and wound onto a winding reel 66, thereby The connecting body 20 of the polymer board and the conductive board is produced.
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