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Improvement of electric paste etching frame

A clamping frame and plasma technology, applied in the direction of circuits, electrical components, electrolysis process, etc., can solve the problems of difficult maneuver adjustment, inability to adapt to etching efficiency, high etching efficiency, etc.

Inactive Publication Date: 2004-09-22
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Generally speaking, the plasma ion concentration and the gap (Gap) or the size of the space volume affect the etching efficiency. A notable example is that when a plasma with a high ion concentration is set in a small enclosed space, the etching efficiency Higher, on the contrary, the etching efficiency is low
[0005] Therefore, the above-mentioned adjustable upper or lower electrode cannot be concentrated for the frame, and the adjustment of the electrode is relatively complicated, and it is difficult to adjust it in a mobile way, while the fixed clamp frame type cannot adapt to the requirements of different etching efficiencies. Need to improve

Method used

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  • Improvement of electric paste etching frame
  • Improvement of electric paste etching frame
  • Improvement of electric paste etching frame

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Embodiment Construction

[0021] For further revealing the concrete technical content of this case, at first please refer to accompanying drawing.

[0022] As shown in FIG. 4 , basically, the improvement of the clamping frame of this case is composed of a clamping frame 1 and a lifting device 2 .

[0023] Wherein, the clip frame 1 is a frame body with open ends up and down, therefore, it is formed by surrounding the frame wall 11. The frame wall 11 can be in any shape, but it is preferably square or rectangular, that is, it can be formed by Surrounded by frame walls 11 vertically arranged on four sides, the bottom has a lifting link device 12, which can be provided with holes such as ears, but it is not limited thereto.

[0024] The material of this frame wall 11 can usually be fine ceramics, in order to be replaceable, so it can be connected in a single piece, and at this time, the lifting connection device can connect a bottom frame 13, and the size of the bottom frame 13 Corresponding to the frame ...

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Abstract

An improved clamp frame for plasma etching is composed of 4 frame walls and has open top and open bottom. A jointer for joining a lifter is arranged to its bottom, lifting or lowering the clamp frame can change the space between clamp frame and workpiece, so changing the concentration of plasma in it.

Description

technical field [0001] The present invention relates to an improved clamping frame device for plasma etching, especially a clamping frame that can be adjusted by lifting and lowering the clamping frame, thereby adjusting the size of the space between the workpiece and the plasma. Background technique [0002] In the manufacturing process of the display panel, the step of plasma etching the plate, especially the glass plate to make it into a liquid crystal panel is indispensable. [0003] The known plasma etching methods can be roughly divided into adjustable upper electrodes, adjustable lower electrodes, and fixed clip frame types. Such as figure 1 As shown, the upper electrode is adjustable, which can be adjusted up and down through the upper electrode A, so that the distance C of the plasma B can be adjusted in size, and then the volume filled with the plasma can be adjusted in size; while the adjustable lower electrode is Such as figure 2 As shown, the lower electrode...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C19/00C25F3/02C25F7/00H01L27/12
Inventor 梁忠棋张昭升黄木上彭顺煌
Owner AU OPTRONICS CORP
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