Electric paste etching frame

Abstract

This case is a plasma etching clamp frame, which is a clamp frame surrounded by frame walls, the top and bottom are open ends, and its size is not smaller than the size of the work piece, and the bottom is equipped with a lifting connection device; The frame encloses the work piece. When the elevating connecting device is connected to the elevating device and moves up and down, the space between the clamping frame and the work piece is changed, thereby changing the plasma ion concentration therein.

Description

technical field [0001] The present invention relates to an improved clamping frame device for plasma etching, especially a clamping frame that can be adjusted by lifting and lowering the clamping frame, thereby adjusting the size of the space between the workpiece and the plasma. Background technique [0002] In the manufacturing process of the display panel, the step of plasma etching the plate, especially the glass plate to make it into a liquid crystal panel is indispensable. [0003] The known plasma etching methods can be roughly divided into adjustable upper electrodes, adjustable lower electrodes, and fixed clip frame types. Such as figure 1 As shown, the upper electrode is adjustable, which can be adjusted up and down through the upper electrode A, so that the distance C of the plasma B can be adjusted in size, and then the volume filled with the plasma can be adjusted in size; while the adjustable lower electrode is Such as figure 2 As shown, the lower electrode...

AI Technical Summary

Problems solved by technology

[0004] Generally speaking, the plasma ion concentration and the gap (Gap) or the size of the space volume affect the etching efficiency. A notable example is that when a plasma with a high ion concentration is set in a small enclosed space, the etching efficiency Higher, on the contrary, the etching efficiency is low

[0005] Therefore, the above-mentioned adjustable upper or lower electrode cannot be concentrated for the frame, and the adjustment of the electrode is relatively complicated, and it is difficult to adjust it in a mobile way, while the fixed clamp frame type cannot adapt to the requirements of different etching efficiencies. Need to improve

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