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Microminiature power converter with multiple output

A power conversion device and ultra-small technology, which are applied in the output power conversion device, the conversion of DC power input into DC power output, and the adjustment of electrical variables, etc., can solve the problems of increased installation area, small size, and increased installation cost.

Active Publication Date: 2011-11-16
FUJI ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, the above-mentioned ultra-small power conversion device has the characteristics of small size and thinness. It is composed of a magnetic induction element and an IC, and it is centered on a single output with one input system and one output system. In order to obtain multiple outputs Requires multiple ultra-small power conversion devices
[0012] In electronic equipment such as portable devices that require ultra-small power conversion devices, multi-output systems are required, that is, devices requiring multiple output voltages increase, and multiple ultra-small power conversion devices are required, and the installation area occupied by ultra-small power conversion devices increases. , the installation cost increases

Method used

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  • Microminiature power converter with multiple output
  • Microminiature power converter with multiple output
  • Microminiature power converter with multiple output

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] figure 1 , figure 2 It is a configuration diagram of main parts of the multi-output ultra-small power conversion device of Embodiment 1 of the invention, figure 1 This is a plan view of main parts when seen through from the upper part of an inductor composed of a thin-film magnetic induction element, figure 2 (a) is in figure 1 The cross-sectional view of the main part when the X-X line is cut, figure 2 (b) is in figure 1 The sectional view of the main part when the Y-Y line is cut. In this example, the number of inductors is two. In these figures, not only the coil pattern of the inductor but also the connection terminals 15a, 15b constituted by the mounting terminals of the inductor for electrical connection are shown.

[0060] exist figure 1 Among them, the coil conductors 12a and 13a are formed on the first main surface of the magnetic insulating substrate 11, and the coil conductors 12b and 13b are formed on the second main surface. The planar shape...

Embodiment 2

[0084] Figure 14 A method of manufacturing a multi-output ultra-small power conversion device according to Embodiment 2 of the present invention is shown, Figure 14 (a) to Figure 14 (c) is a cross-sectional view of main steps showing the sequence of steps. Here, a method of manufacturing a ferrite substrate is shown.

[0085] In Example 1, a resin was used as a material of the magnetic separation layer 17, but in this Example, a ceramic material was used. In the above-mentioned case of using the resin, the method is adopted to form the slit 41 in the ferrite substrate 11 in the process after the ferrite substrate 11 is sintered, and fill the slit 41 with the resin. In this embodiment, it is formed by simultaneously sintering ferrite and ceramics.

[0086] First, if Figure 14 As shown in (a), the printed circuit board 51 before ferrite sintering is formed.

[0087] Below, such as Figure 14 As shown in (b), the cutout 52 and the through holes 53 and 54 are formed on ...

Embodiment 3

[0094] Figure 16 It is a configuration diagram of main parts of a multi-output ultra-small power conversion device according to Embodiment 3 of the present invention, Figure 16 (a) is a main part plan view of the first inductor, Figure 16 (b) is a plan view of main parts of the second inductor. These figures are plan views of main parts seen from the top of the inductor composed of a thin-film magnetic induction element.

[0095] Respectively, the plan view of the first inductor 60a in which the first coil conductors 62a, 62b and the first connection terminals 65a, 65b are formed on the first magnetic insulating substrate (hereinafter referred to as the first substrate 61a), and the first inductor 60a formed on the second magnetic insulating substrate A plan view of a second inductor 60b in which second coil conductors 63a, 63b and second connection terminals 66a, 66b are formed on a substrate (hereinafter referred to as a second substrate 61b). Also, 62a, 63a, 65a, and ...

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Abstract

Provided is a multi-output microminiature power conversion device having a plurality of output systems, which has a voltage output of multiple type and a small mounting area and which is small-sized and slim. Coil conductors 12a, 13a are formed in a first main face of a magnetically insulated board 11, and coil conductors 12b, 13b are formed in a second face of the magnetically insulated board 11. The planar shapes of the coil conductors 12b, 13b formed in the second face are of straight line shape, which are electrically connected to the coil conductors 12a, 13a of the first main face via a connection conductor 14 formed in a through-hole to form two inductors 1, 2 having solenoid coils. These inductors 1, 2 are magnetically separated from each other by a magnetic separation layer 17. The multi-output microminiature power conversion device is constituted of the plurality of inductors.

Description

technical field [0001] The present invention relates to an ultra-small power conversion device with multiple outputs, such as a DC-DC converter formed of a semiconductor integrated circuit (hereinafter referred to as IC) formed on a semiconductor substrate, and passive components such as coils, capacitors, and resistors. . Background technique [0002] In recent years, electronic information equipment, especially portable various electronic information equipment has been widely popularized. Most of these electronic information devices use batteries as power sources and have built-in power conversion devices such as DC-DC converters. A general power conversion device is configured by arranging active elements such as switching elements, rectifying elements, and control ICs, and passive elements such as coils, transformers, capacitors, and resistors, on a printed circuit board such as a ceramic substrate or plastic. hybrid components. [0003] Figure 32 It is a circuit con...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/00H01F17/00H01F37/00H01F27/24H01F27/28H01L21/60H01L23/522H01L25/00H02M3/00H02M3/155
CPCH01L24/81H01L2224/81801H01F27/2804H01L2924/19015H01F27/24H01L2924/19106H01L23/5227H02M3/00H01L2924/01012H01L2924/01068H01L2224/81205H01L2924/13091H01L2924/12042H01L2924/14H02M3/003H01L2924/00
Inventor 江户雅晴西尾春彦
Owner FUJI ELECTRIC CO LTD