Laser machining apparatus and laser machining method

a laser machining and laser machining technology, applied in the direction of soldering apparatus, manufacturing tools,auxillary welding devices, etc., can solve the problems of inability to achieve the effect of improving work efficiency, no large installation area, and reducing machining efficiency
US20050045606A1Active Publication Date: 2005-03-03HITACHI SEIKO LTD

Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
HITACHI SEIKO LTD
Publication Date
2005-03-03

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Abstract

There is provided a laser machining apparatus, and a laser machining method using the same, which allows an installation area thereof to be reduced while improving working efficiency. The laser machining apparatus has a body portion having a plurality of laser irradiating sections and work mounting sections, a supplying stocker for supplying workpieces, and a discharging stocker for discharging the workpieces. The apparatus further comprises a supply-side transfer unit having work retaining tables capable of attaching / detaching the workpieces and of the same number with the laser irradiating sections, and moving the work retaining tables in the vertical and horizontal directions, and a discharge-side transfer unit having work retaining tables capable attaching / detaching the workpieces and of the same number with the laser irradiating sections, and moving the work retaining tables in the vertical and horizontal directions. The supply-side unit causes the plurality of supply-side work retaining tables to adsorb the workpieces from the supplying stocker one after another and moves these supply-side work retaining tables to the work mounting sections to place the workpieces thereon. The discharge-side unit causes the discharge-side work retaining tables to adsorb the workpieces which have been machined at the work mounting sections to move and discharge those workpieces to the discharging stocker.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a laser machining apparatus comprising a plurality of laser irradiating sections and work mounting tables disposed so as to face to the laser irradiating sections and to a laser machining method using the laser machining apparatus.

[0003] 2. Description of Related Art

[0004] As a prior art laser machining apparatus, there has been known a laser machining apparatus having a plate-like work supplying unit, as disclosed in Japanese Patent Laid-open No. 2001-139170 for example, comprising work transferring means for transferring plate-like workpieces from a first work mounting section to a second work mounting section, workpiece thickness detecting means for detecting whether or not one workpiece is mounted on the second work mounting section, and work transfer control means for controlling, when the workpiece thickness detecting means detects that a plurality of workpieces is mounted on...

Claims

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