Laser machining apparatus and laser machining method
Patent Information
- Authority / Receiving Office
- US · United States
- Current Assignee / Owner
- HITACHI SEIKO LTD
- Publication Date
- 2005-03-03
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Abstract
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a laser machining apparatus comprising a plurality of laser irradiating sections and work mounting tables disposed so as to face to the laser irradiating sections and to a laser machining method using the laser machining apparatus.
[0003] 2. Description of Related Art
[0004] As a prior art laser machining apparatus, there has been known a laser machining apparatus having a plate-like work supplying unit, as disclosed in Japanese Patent Laid-open No. 2001-139170 for example, comprising work transferring means for transferring plate-like workpieces from a first work mounting section to a second work mounting section, workpiece thickness detecting means for detecting whether or not one workpiece is mounted on the second work mounting section, and work transfer control means for controlling, when the workpiece thickness detecting means detects that a plurality of workpieces is mounted on...