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Optical receiver module with to-can structure

A technology of optical receivers and containers, applied in electromagnetic receivers, electric solid-state devices, semiconductor devices, etc., can solve the problems of increased impedance mismatch, RF signal strength and bandwidth weakening, etc.

Inactive Publication Date: 2005-02-02
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since part of the RF signal is reflected, the signal strength and bandwidth of the RF signal output to the outside of the optical receiver module are weakened
[0009] In addition, the impedance mismatch between the transimpedance amplifier and the signal leads increases when the optical receiver module is used in a high-speed optical communication network

Method used

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  • Optical receiver module with to-can structure
  • Optical receiver module with to-can structure
  • Optical receiver module with to-can structure

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Embodiment Construction

[0021] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. For clarity and conciseness, detailed descriptions of known functions and constructions contained herein will be omitted since they would obscure the subject matter of the present invention.

[0022] image 3 is a perspective view of an optical receiver module with a TO-Can structure according to an embodiment of the present invention. Please see image 3 , the photoreceiver module 200 with TO-Can structure comprises: transistor base 201, wherein hole 203 passes through the both sides of described transistor base; ) 210; a transimpedance amplifier (TIA) 220 also mounted on the upper side of the transistor holder 201; a DC lead 202a passing through the hole 203 of the transistor holder 201; a signal lead 202b also passing through the hole 203 of the transistor holder 201; a first waveguide 230 and the second waveguide 240 .

[0023] The photod...

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PUM

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Abstract

An optical receiver module is disclosed with a top open can (TO-Can) structure that includes a stem with holes thereon. The holes pass through both sides of the stem. A photo diode mounted on an upper side of the stem, for converting an optical input signal into an electric current. The optical receiver module includes a trans-impedance amplifier, mounted on the upper side of the stem, converts the electric current output from the photo diode into RF signals having opposite phases, amplifies the converted RF signals, and outputs the amplified RF signals to the outside via corresponding output terminals. Signal leads, passing through the holes formed on the stem, output the RF signals having the opposite phases amplified by the trans-impedance amplifier to the outside. Ground leads, extending from a lower part of the stem, ground the stem to the outside of the optical receiver module. Waveguides, mounted in a predetermined position on the upper side of the stem, match impedances between the trans-impedance amplifier and the leads. The waveguides conduct the RF signals output from the output terminals of the trans-impedance amplifier to the respective leads via corresponding electric paths.

Description

technical field [0001] The present invention relates generally to optical receiver modules, and more particularly to optical receiver modules having a top-open-can (hereinafter referred to as "TO-Can") structure for high-speed optical communications. The optical receiver module may include a photodiode for converting an optical input signal into an electric current. Background technique [0002] In order to meet the increasing demand for optical communication capacity, high-speed optical communication systems capable of supporting speeds of 10 GHz or higher have been developed. Such a system may include an optical communication module having a butterfly structure in which active devices for light transmission / reception are integrated on a flat-shaped substrate, and a TO-Can structure in the TO-Can structure. The upper side of the transistor seat in the Can structure is covered, on which the active devices for light emission / reception are integrated. The optical module has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/02G02B6/42
CPCH04B10/66H01L2224/48137H01L2924/30107H01L2924/3011H01L2224/05554H01L2924/00G02B6/42
Inventor 白宰明徐昊成金维植
Owner SAMSUNG ELECTRONICS CO LTD