Electronic circuit unit

Abstract

Provided is an electronic circuit unit in which migration between wiring patterns is prevented and shorting between the wiring patterns does not exist. The electronic circuit unit is provided with a circuit board (1) formed of an insulating material, the wiring patterns (2) formed on at least one face of the circuit board (1), and a semiconductor component (10) having terminals (10b) connected to the wiring patterns (2). The wiring pattern (2) is provided with a plurality of connection parts (3) which are disposed by leaving intervals and connect the terminals (10b), and a plurality of first conductive patterns (4) which extend from the connection parts (3) and are disposed by leaving the intervals. The connection parts (3) and the first conductive patterns (4) which extend from the connection parts (3) to positions near the semiconductor component (10) are formed of gold materials. Thus, migration (transition of silver) between the connection parts and that between the first conductive patterns in a high density state near the semiconductor component are prevented, and shorting between the wiring patterns is eliminated.

Description

technical field [0001] The present invention relates to electronic circuit units suitable for use in television tuners and the like. Background technique [0002] First, drawings of conventional electronic circuit units will be described. Figure 5 It is a perspective view showing the main part of the existing electronic circuit unit. [0003] Second, according to Figure 5 , to describe the structure of the existing electronic circuit unit. A mounting region 51a for mounting a semiconductor component (not shown) is provided on one surface of a circuit board 51 made of an insulating material, and wiring patterns are formed on the outer peripheral portion of the mounting region 51a at intervals. 52. [0004] And, the wiring pattern 52 has: a connection portion 52a connected to a terminal (not shown) of a semiconductor component, a conductive pattern 52b extending from the connection portion 52a, and a conductive pattern 52b provided on the conductive pattern 52b for connect...

AI Technical Summary

Problems solved by technology

[0011] If the existing electronic circuit unit is to be miniaturized, especially the wiring pattern 52 formed by using the silver material connecting the semiconductor components is very dense, so migration (movement of silver) occurs during use, and there is a short circuit between the wiring patterns 52, Circumstances that cause electrical damage

[0012] And, between the connection parts 52a of the wiring patterns 52 formed by silver material and between the conductive patterns 52b, an interval of less than 200 μm is formed, so there is migration (movement of silver) in the use process, and the wiring patterns 52 Short circuit, the problem of causing electrical damage

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