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Method for improving fine enamelled wire spot welding strengh in spot welding

A kind of enameled wire, subtle technology, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problems of broken wires, wire falling off, etc., to prevent falling off, eliminate hidden dangers of circuits, and ensure the effect of normal work

Inactive Publication Date: 2005-03-02
MORNSUN GUANGZHOU SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can not only ensure the stability of the welding between the thin enameled wire and the circuit board, but also effectively solve the problem of wire falling off from the solder joint and broken wire

Method used

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  • Method for improving fine enamelled wire spot welding strengh in spot welding
  • Method for improving fine enamelled wire spot welding strengh in spot welding
  • Method for improving fine enamelled wire spot welding strengh in spot welding

Examples

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Embodiment Construction

[0014] Such as image 3 Shown is one of the embodiments of the present invention, the fine enameled wire 1 and the circuit board 3 are welded to each other through the solder joint 2, the fine enameled wire 1 and the solder joint 2 intersect at point A, and the point A is close to the board surface of the circuit board 3. The fine enameled wire 1 is bent and folded directly around the edge of the circuit board 3, and pulled to the back of the solder joint of the circuit board to use or connect components; the fulcrum B is formed at the bottom of the circuit board 3, and the fine enameled wire swing section 1' is pulled with B as the fulcrum. out or connect components. When the fine enameled wire 1 is subjected to external forces such as pulling force, swinging up and down, twisting, etc., it avoids direct action on the point A intersecting with the solder joint 2, thereby effectively protecting the welding of the fine enameled wire and the circuit board, and preventing the wir...

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Abstract

This invention discloses a method for improving fine enamel wire soldered dot strength in spot welding which pulls out the enamel wire already weldered to and bended around the CB to use or connect it with other elements. This invention takes the CB as the support and folds the enamel wire to transfer its stress point, the foreign forces of pull, swinging up and down or twist on the wire will not act upon the welded points on the CB to pretect the welding and prevent the wire form breaking or dropping suitable for levels under 10-1mm.

Description

technical field [0001] The invention relates to a welding method, in particular to a method for improving the strength of tiny enameled wire solder joints in the spot welding of enameled wires with a diameter of less than 10-1 mm and circuit boards. Background technique [0002] Currently in diameter 10 -1 In the case where the fine enameled wire below the mm level is welded to the circuit board, the use state can be a single fine enameled wire, or it can be a bundle of fine enameled wires. For the above fine enameled wires, the SW point electric welding method is usually used for mutual welding, and the SW electronic point The welding machine has the function of directly welding the enameled wire without removing the insulating varnish in advance. Its basic working principle is that spot welding is a welding in which a strong current passes through two point electrodes (including parallel electrodes) that are pressed and overlapped in a short period of time to form solder ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K2201/09063H05K3/328H05K2201/056H05K2201/10287H05K2201/10446H05K2201/09145Y10T29/49144H05K3/306
Inventor 尹向阳
Owner MORNSUN GUANGZHOU SCI & TECH
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