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Polishing pad support that improves polishing performance and longevity

A polishing pad, polishing agent technology, applied in grinding/polishing equipment, control of workpiece feed movement, wheels with flexible working parts, etc., can solve problems such as short-term

Inactive Publication Date: 2005-07-20
PSILOQUEST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this modification can be short-lived, thus requiring frequent replacement or reprocessing of CMP gaskets

Method used

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  • Polishing pad support that improves polishing performance and longevity
  • Polishing pad support that improves polishing performance and longevity
  • Polishing pad support that improves polishing performance and longevity

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Embodiment Construction

[0023] The present invention discloses a polishing pad that provides superior polishing performance over a longer period of use than conventional pads. The present invention takes advantage of the previously unrealized advantage of using a thermoplastic polymer as a substrate for depositing a uniform coating of polish on concave cells formed by skiving on the surface of the substrate. It has been found that the interior surfaces of the concave cells form excellent receptacles for receiving a uniform coating of polish. While not limiting the scope of the invention by theory, it is hypothesized that the center of the concave cells acts as an excellent nucleation site for the coating because the surface energy of the cell is lowest at the center. It is believed that initial coating at this location facilitates uniform coverage of the concave cell interior surface with polishing compound, thereby aiding the polishing performance of pads having such surfaces.

[0024] As used here...

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Abstract

The present invention provides, polishing pad with improved polishing properties and longevity. The pad is comprised of a thermoplastic foam substrate having a surface comprised of concave cells. A polishing agent coats an interior surface of the concave cells. The invention includes a method for preparing the polishing pad, and a polishing apparatus comprising the polishing pad.

Description

technical field [0001] This invention relates to polishing pads for use in producing smooth, ultra-flat surfaces on objects such as glass, semiconductors, dielectric / metal composites, magnetic storage media, and integrated circuits. More specifically, the present invention relates to gaskets comprised of a thermoplastic foam matrix having surfaces comprised of concave cells and a polish coating the interior surfaces of the concave cells. Background technique [0002] In the fabrication of VLSI integrated circuits, chemical-mechanical polishing (CMP) is widely used as a planarization technique. In IC processing, it has the potential to planarize various materials, but is most widely used to planarize metallization layers and interlevel dielectrics on semiconductor wafers, and to make shallow trench isolation Planarization with substrates. In shallow trench isolation (STI), for example, large field oxygen regions must be polished to produce a planar starting wafer. Achievin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/24B24B49/16B24D3/00B24D3/26B24D3/34B24D11/00B24D13/14H01L21/304
CPCB24D3/26Y10T428/249976B24B37/24Y10T428/249987Y10T428/249975Y10T428/249953Y10T428/249991B24B49/16
Inventor Y·S·奥本P·A·托马斯
Owner PSILOQUEST