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Electronic microcircuit module band

A microcircuit and electronic technology, applied in the direction of circuits, electrical components, electric solid-state devices, etc., can solve problems such as limited long-term reliability

Inactive Publication Date: 2010-05-12
MICROCONNECTIONS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is necessary to use this adhesive film in order for the micromodule to be attached to the bottom of the cavity, even if its long-term reliability is limited.

Method used

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  • Electronic microcircuit module band
  • Electronic microcircuit module band
  • Electronic microcircuit module band

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] figure 1 An electronic microcircuit module 1 according to the invention is shown. The module 1 comprises a substrate 2, which forms a plane. The substrate 2 is preferably made of an insulating material such as prepreg, especially polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or even polyimide. made of amines. In a particular embodiment, the substrate has a thickness on the order of 25 microns.

[0027] On the first side 3 of the substrate 2 the module 1 has a contact region 4 . The contact area 4 is, for example, a printed circuit. The printed circuit is formed by laminating a copper layer with a thickness of 18 to 35 microns to a substrate. This copper layer is held on the first side 3 by a pre-deposited adhesive. Subsequently, the substrate 2 with the copper layer is usually chemically etched to form a printed circuit 4 .

[0028] The substrate 2 also has holes 5 formed in the plane defined by the substrate and having its first side 3 attach...

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PUM

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Abstract

The invention relates to a method for encapsulation of an electronic microcircuit (1) for production of an electronic module which may be fixed by means of a simple glue or soldered. Said microcircuithas a geometrical form which fits a housing on a card (19) provided for the above and with a masking means (7) corresponding to said card. Said mask thus prevents a bleeding of a coating resin (14) used to protect a chip (10) on such a module. The mask is glued to a support (2) with the contact pad (4) on a first face (3) and the mask and chip on a second face (6). The mask has a window (9) to fix the placing of the chip.

Description

technical field [0001] The subject of the invention is a method of encapsulating modular electronic microcircuits, each of which is designed to accommodate an integrated circuit, usually called a chip, thus constituting an electronic microcircuit module. Another subject of the invention is the electronic microcircuit module thus obtained. In fact, with the increase in the production of chip cards equipped with such modules and the increasing use of chip cards in everyday life, the process of manufacturing these modules needs to be improved to meet the demand in quantity, sometimes The quality and reliability of the product will be impaired. The invention also relates to the mounting of these modules on chip cards or other substrates. Background technique [0002] The chip card is formed by placing an electronic microcircuit module in a cavity in the thickness direction of the card. Such an electronic module has a microcircuit on the visible side of the card, the upper con...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077H01L23/02H01L23/12
CPCH01L2924/01087G06K19/07743H01L2924/01057G06K19/07745H01L2224/48465H01L2924/01078H01L2224/73265H01L2224/48228G06K19/07747H01L2224/48227H01L2924/0102H01L2924/01079H01L2224/32225Y10T156/1056Y10T156/1057H01L2924/00G06K19/077
Inventor 让-皮埃尔·拉德纳延尼克·德马奎勒让-雅克·米施勒克里斯托弗·马蒂厄
Owner MICROCONNECTIONS