Exposure apparatus and exposure method and correction method

Abstract

The invention provides an exposure apparatus and exposure method and correction method for correcting an exposure position aligning function the accuracy of which is influenced by the factor of posture changes accompanied by movement of an alignment camera to image an alignment mark of a photosensitive material, and for improving the correction accuracy for deviation of the exposure position on the photosensitive material. Prior to imaging an alignment mark of a photosensitive material by a CCD camera, a reference plate having a plurality of detection marks arranged at a predetermined interval along the moving direction of the CCD camera is disposed at a position where imaging is possible by the CCD camera. At least one of the detection marks is imaged by the CCD camera placed at the position to image an alignment mark formed on the photosensitive material. Calibration data is calculated based on the data of optical axis deviation of the camera acquired by imaging, and the calibration data is reflected on the reference position data to calibrate the exposure position aligning function of the exposure apparatus.

Description

technical field [0001] The present invention relates to a calibration method of an exposure device, an exposure method and an exposure device, and in particular to a calibration method of an exposure device for correcting an exposure alignment function in an exposure device that uses a light beam modulated by a spatial modulation element to expose a photosensitive material according to image information, Exposure method and exposure apparatus. Background technique [0002] Conventionally, various exposure apparatuses have been proposed that perform image exposure using a spatial light modulator (SLM) such as a digital micromirror device (DMD) using a light beam modulated according to image data (image information). [0003] For example, a DMD is a mirror device in which a plurality of micromirrors that change the angle of the reflection surface according to a control signal are arranged two-dimensionally on a semiconductor substrate such as silicon. In the exposure device o...

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Problems solved by technology

In this way, because of the large reference mask, the drawing table becomes larger and heavier in the thickness direction, and since the adsorption plate is made of glass, there is a problem that damage resistance such as impact resistance and durability are reduced.

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