Exposure apparatus and exposure method and correction method

A technology of exposure device and exposure position, which is applied in the direction of photolithography exposure device, microlithography exposure equipment, optics, etc., and can solve the problems of damage resistance and durability reduction

Inactive Publication Date: 2005-10-05
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, because of the large reference mask, the drawing table becomes larger and heavier in the thickness direction, and since the adsorption plate is made of glass, there is a problem that damage resistance such as impact resistance and durability are reduced.

Method used

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  • Exposure apparatus and exposure method and correction method
  • Exposure apparatus and exposure method and correction method
  • Exposure apparatus and exposure method and correction method

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Embodiment Construction

[0068] Hereinafter, an exposure apparatus according to an embodiment of the present invention will be described with reference to the drawings.

[0069] figure 1 An exposure apparatus according to one embodiment of the present invention is shown. also, Figure 2 ~ Figure 6 Indicates the exposure head and the spatial light modulation element used in the exposure apparatus of this embodiment, Figure 7 A calibration unit used in the exposure apparatus of this embodiment is shown.

[0070] Such as figure 1 As shown, the exposure apparatus 10 has a rectangular thick plate-shaped installation table 18 supported by four legs 16 . On the upper surface of the installation table 18, two guide rails 20 are provided extending in the longitudinal direction, and on the two guide rails 20, a rectangular flat disk-shaped object stage 14 is provided. The stage 14 is arranged longitudinally toward the extending direction of the guide rail 20, supported by the guide rail 20 to move back an...

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Abstract

The invention provides an exposure apparatus and exposure method and correction method for correcting an exposure position aligning function the accuracy of which is influenced by the factor of posture changes accompanied by movement of an alignment camera to image an alignment mark of a photosensitive material, and for improving the correction accuracy for deviation of the exposure position on the photosensitive material. Prior to imaging an alignment mark of a photosensitive material by a CCD camera, a reference plate having a plurality of detection marks arranged at a predetermined interval along the moving direction of the CCD camera is disposed at a position where imaging is possible by the CCD camera. At least one of the detection marks is imaged by the CCD camera placed at the position to image an alignment mark formed on the photosensitive material. Calibration data is calculated based on the data of optical axis deviation of the camera acquired by imaging, and the calibration data is reflected on the reference position data to calibrate the exposure position aligning function of the exposure apparatus.

Description

technical field [0001] The present invention relates to a calibration method of an exposure device, an exposure method and an exposure device, and in particular to a calibration method of an exposure device for correcting an exposure alignment function in an exposure device that uses a light beam modulated by a spatial modulation element to expose a photosensitive material according to image information, Exposure method and exposure apparatus. Background technique [0002] Conventionally, various exposure apparatuses have been proposed that perform image exposure using a spatial light modulator (SLM) such as a digital micromirror device (DMD) using a light beam modulated according to image data (image information). [0003] For example, a DMD is a mirror device in which a plurality of micromirrors that change the angle of the reflection surface according to a control signal are arranged two-dimensionally on a semiconductor substrate such as silicon. In the exposure device o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03G15/04G03G15/043
CPCG03G15/043G03G2215/04H01P1/2053H01P1/2084H01P7/06
Inventor 上村宽福田刚志
Owner FUJIFILM CORP
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