Substrate processing apparatus and substrate positioning device

A substrate processing device and a technology for substrates, which can be applied to devices that apply liquid to surfaces, machines that arrange working positions in sequence, and coating of discharge tubes, etc. , to achieve the effect of saving space

Active Publication Date: 2006-03-15
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to apply this conventional substrate positioning device to a spinless resist coating device.
That is, the linear push mechanism requires a considerable amo

Method used

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  • Substrate processing apparatus and substrate positioning device
  • Substrate processing apparatus and substrate positioning device
  • Substrate processing apparatus and substrate positioning device

Examples

Experimental program
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Embodiment Construction

[0051] Below, we refer to the attached Figure 1 Preferred embodiments of the present invention will be described above.

[0052] figure 1 A coating and development processing system is shown as an example of the configuration of a substrate processing apparatus to which the present invention can be applied. The coating and development processing system 10 is set in a clean room, for example, the LCD substrate is used as the substrate to be processed, and the cleaning, resist coating, pre-baking, development and post-processing in the photolithography process are performed in the LCD manufacturing process. A series of processes such as baking. Exposure processing is performed by an external exposure device 12 provided adjacent to the processing system.

[0053] In this coating and development processing system 10, a horizontally long processing station (P / S) 16 is arranged at the central part, and a cartridge mounting station (C / S) 14 and an interface station are arranged a...

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PUM

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Abstract

PROBLEM TO BE SOLVED: To position a substrate to be processed efficiently by saving space. ŽSOLUTION: After having transferred a substrate G to a lift pin 132, each rotation driving portion 152 rotates each eccentric movable alignment pin 150 to nearly half rotating location from an original location through a rotation driving shaft 154. Then, the alignment pin 150 transfers toward each side of the substrate G in face to face with the pin while performing eccentric rotating movement, and a collar (contacting portion) 150b contacts with a substrate edge (substrate side). Furthermore, the pin pushes the substrate G from there. This makes the substrate G in displacement or transfer toward a pushed direction on the lift pin 132, and the opposite long side of the substrate G is pushed to a fixing alignment pin. As a result, the substrate G is caught in between the eccentric movable alignment pin 150 and the fixing alignment pin, then its positioning is finished. Ž

Description

technical field [0001] The present invention generally relates to a substrate processing apparatus that applies processing to a substrate to be processed on a stage, and particularly relates to a technique for determining a position of a substrate. Background technique [0002] Recently, in the photolithography process of the flat panel display (FPD) manufacturing process, as a resist coating method that is advantageous for increasing the size of the substrate to be processed (such as a glass substrate), the substrate is sprayed with a resist nozzle A non-spin method that sprays resist solution with a fine diameter continuously, and applies a resist solution with a desired film thickness on the substrate without rotational motion by relatively moving the resist nozzle while scanning is becoming popular. [0003] Generally, according to the resist coating apparatus of the non-spin system, as described in Patent Document 1, for example, a substrate placed horizontally on a sta...

Claims

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Application Information

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IPC IPC(8): G03F9/00G03F7/16B05C5/02H01L21/027H01L21/68
CPCG03F7/707H01J9/20H01J9/48H01J2209/015H01L21/027H01L21/68
Inventor 元田公男立山清久富田龙生
Owner TOKYO ELECTRON LTD
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