Substrate processing apparatus and substrate positioning device

Abstract

PROBLEM TO BE SOLVED: To position a substrate to be processed efficiently by saving space. ŽSOLUTION: After having transferred a substrate G to a lift pin 132, each rotation driving portion 152 rotates each eccentric movable alignment pin 150 to nearly half rotating location from an original location through a rotation driving shaft 154. Then, the alignment pin 150 transfers toward each side of the substrate G in face to face with the pin while performing eccentric rotating movement, and a collar (contacting portion) 150b contacts with a substrate edge (substrate side). Furthermore, the pin pushes the substrate G from there. This makes the substrate G in displacement or transfer toward a pushed direction on the lift pin 132, and the opposite long side of the substrate G is pushed to a fixing alignment pin. As a result, the substrate G is caught in between the eccentric movable alignment pin 150 and the fixing alignment pin, then its positioning is finished. Ž

Description

technical field [0001] The present invention generally relates to a substrate processing apparatus that applies processing to a substrate to be processed on a stage, and particularly relates to a technique for determining a position of a substrate. Background technique [0002] Recently, in the photolithography process of the flat panel display (FPD) manufacturing process, as a resist coating method that is advantageous for increasing the size of the substrate to be processed (such as a glass substrate), the substrate is sprayed with a resist nozzle A non-spin method that sprays resist solution with a fine diameter continuously, and applies a resist solution with a desired film thickness on the substrate without rotational motion by relatively moving the resist nozzle while scanning is becoming popular. [0003] Generally, according to the resist coating apparatus of the non-spin system, as described in Patent Document 1, for example, a substrate placed horizontally on a sta...

AI Technical Summary

Problems solved by technology

However, it is difficult to apply this conventional substrate positioning device to a spinless resist coating device.

That is, the linear push mechanism requires a considerable amount of dedicated space, resulting in an increase in size and complexity around the stage, and unavoidable interference with the scanning mechanism for the elongated resist nozzle.

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