70results about "Discharge tube coating" patented technology

To provide a substrate consisting of carbon or non-metallic materials containing carbon with a layer of a metal having a high melting point, first an undercoat layer is applied to the substrate by plasma spraying in an inert atmosphere. The undercoat layer predominantly consists of rhenium, molybdenum, zirconium, titan, chrome, niobium, tantalum, hafnium, vanadium, platinum, rhodium or iridium. Onto that undercoat layer, a covering layer can be applied, by plasma spraying as well. In order to reduce the thermo-mechanical stress and to improve the adhesion of the undercoat layer on the surface of the substrate, the substrate is preheated prior to applying the undercoat layer. By means of such a method, carbon-containing substrates can be provided with an undercoat layer and, if required, with a covering layer quickly and reliably at low costs.

A method and an apparatus for fabricating a pattern which makes it possible to obtain a wide pattern having edges of a preferable shape. The apparatus for fabricating a pattern ejects a liquid material as liquid droplets from an ejecting section, and dispose the liquid droplets on a substrate in a line-shaped pattern. A plurality of line-shaped patterns are formed on the substrate by disposing a plurality of liquid droplets on the substrate in the line-shaped patterns, and then another set of liquid droplets are disposed between the line-shaped patterns so as to integrate the line-shaped patterns with each other.

A method of manufacturing plasma display panels using a substrate holder for deposition on a substrate of the plasma display panel. The substrate holder is configured with plural frames, and the substrate of the plasma display panel is held by its periphery with at least one of these frames. A frame holding the substrate has a protrusion extending to a non-deposition face of the substrate held in such a way as to surround the substrate. Since the protrusion acts as a blocking sheet, attachment of a deposition material passing through an opening on the substrate holder and reaching onto the non-deposition face of the substrate is suppressed.

Device and method for fabricating a display panel having ink-jet printing applied thereto, the device including a stage for supporting a substrate, a base having one or more than one rail for transporting the stage, and one or more than one ink-jet head rotatable by an angel for spraying a pattern forming solution to the substrate, thereby reducing a fabrication cost and simplifying a fabrication process.

This disclosure relates to an apparatus and a method for making or baking a fluorescent lamp. An apparatus for baking a fluorescent lamp includes a heater to heat a plurality of quartz tubes. Each tube has a fluorescent lamp provided therein. A plurality of rollers rotates the quartz tubes placed thereon, and a transfer block has a plurality of auxiliary rollers. The transfer block is configured to move in a first direction to transfer the plurality of quartz tubes from the plurality of rotating rollers to the plurality of auxiliary rollers. A process for heating at least one fluorescent lamp includes a step of providing a plurality of quartz tubes on a plurality of rotating rollers, at least one quartz tube having a fluorescent lamp provided therein, heating the plurality of quartz tubes while being rotated on the plurality of rollers, and transferring the plurality of quartz tube using a transfer block having a plurality of auxiliary rollers.

A meniscus of applying fluid is controlled by applying a voltage to a discharge-nozzle side electrode and a counter electrode placed downstream of the discharge nozzle and by increasing or decreasing fluid pressure inside a pump chamber with use of a mechanism for rotational motion or rectilinear motion.

A plasma display panel (PDP), includes first and second substrates facing each other, a plurality of first and second electrodes along a first direction between the first and second substrates, a plurality of third electrodes along a second direction between the first and second substrates, barrier ribs between the first and second substrates, the barrier ribs defining a plurality of pixels and exhaust areas between the pixels, and photoluminescent layers, the photoluminescent layers being in the pixels, on the barrier ribs, and in the exhaust areas.

A meniscus of applying fluid is controlled by applying a voltage to a discharge-nozzle side electrode and a counter electrode placed downstream of the discharge nozzle and by increasing or decreasing fluid pressure inside a pump chamber with use of a mechanism for rotational motion or rectilinear motion.

Disclosed is a method of manufacturing an emitter in which the tip of the emitter can be formed into a desired shape even when various materials are used for the emitter. The method includes performing an electrolytic polishing process of polishing a front end of a conductive emitter material so that a diameter of the front end is gradually reduced toward a tip; performing a first etching process by irradiating a processing portion of the emitter material processed by the electrolytic polishing process with a charged particle beam; performing a sputtering process by irradiating the pointed portion formed by the first etching process with a focused ion beam; and performing a secondary etching process of further sharpening the tip by an electric field induced gas etching processing while observing a crystal structure of the tip of the pointed portion processed by the sputtering process using a field ion microscope.

The invention discloses a dynode structure and an arc dynode electron multiplier based on the same. The electron multiplier comprises a base frame box body, a gate electrode and a metal substrate. The base frame box body having a quarter cylinder structure consists of a base plate, a first side plate, and a second side plate; the base plate has an arc structure; and the first side plate and the second side plate are connected with the two sides of the base plate. The metal substrate is fixed on the base plate and the upper surface of the metal substrate is an internally-recessed arc surface; a thin oxide film grows on the upper surface of the metal substrate by using a magnetron sputtering method; and the metal substrate is arranged between the first side plate, the second side plate, and the base plate and an incident electron is accelerated by the gate electrode and then enters the thin oxide film. The dynode of the electron multiplier has a uniform structure; the transmitting efficiency of the secondary electron is high; the service life is long; and installation becomes simple and convenient.

The invention discloses an ultraviolet lamp production process, which comprises a film coating step, a first press-sealing step, an exhaust pipe connecting step, a second press-sealing step, a gas pumping and filling step and a lamp holder mounting step. In the film coating step, an aluminum oxide film is generated on the inner wall of a glass pipe. In the first press-sealing step, one end of a first electrode is arranged in a first electrode mounting end in a penetrating manner, and the first electrode mounting end is subjected to hot melting and flattening to fix the first electrode. In theexhaust pipe connecting step, an exhaust pipe is connected to the glass pipe. In the second press-sealing step, one end of a second electrode is arranged in a second electrode mounting end in a penetrating manner, and the second electrode mounting end is subjected to hot melting and flattening to fix the second electrode. In the gas pumping and filling step, foreign gas in the glass pipe is pumpedout, the glass pipe is then filled with functional gas, the exhaust pipe is removed, and a lamp tube assembly is manufactured. In the lamp holder mounting step, lamp holders are mounted at the firstelectrode mounting end and the second electrode mounting end. The ultraviolet lamp production process disclosed by the invention has the advantage that the service life of an ultraviolet lamp can be prolonged.